Methods and devices for fabricating and assembling printable semiconductor elements
First Claim
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1. A method for assembling a printable semiconductor element on a receiving surface of a substrate, said method comprising the steps of:
- providing said printable semiconductor element comprising a unitary inorganic semiconductor structure;
contacting said printable semiconductor element with a conformable transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor element binds said printable semiconductor element to said contact surface, thereby forming said contact surface having said printable semiconductor element disposed thereon;
contacting said printable semiconductor element disposed on said contact surface with said receiving surface of said substrate; and
separating said contact surface of said conformable transfer device and said printable semiconductor element, wherein said printable semiconductor element is transferred onto said receiving surface, thereby assembling said printable semiconductor element on said receiving surface of said substrate.
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Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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Citations
18 Claims
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1. A method for assembling a printable semiconductor element on a receiving surface of a substrate, said method comprising the steps of:
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providing said printable semiconductor element comprising a unitary inorganic semiconductor structure; contacting said printable semiconductor element with a conformable transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor element binds said printable semiconductor element to said contact surface, thereby forming said contact surface having said printable semiconductor element disposed thereon; contacting said printable semiconductor element disposed on said contact surface with said receiving surface of said substrate; and separating said contact surface of said conformable transfer device and said printable semiconductor element, wherein said printable semiconductor element is transferred onto said receiving surface, thereby assembling said printable semiconductor element on said receiving surface of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification