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Method of processing substrate, method of manufacturing solid-state imaging device, method of manufacturing thin film device, and programs for implementing the methods

  • US 7,622,392 B2
  • Filed: 02/21/2006
  • Issued: 11/24/2009
  • Est. Priority Date: 02/18/2005
  • Status: Active Grant
First Claim
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1. A method of manufacturing a solid-state imaging device, the method comprising:

  • an insulating film exposure step of exposing an insulating film on a substrate of the solid-state imaging device to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure; and

    an insulating film heating step of heating to a predetermined temperature the insulating film that has been exposed to the atmosphere of the mixed gas,wherein in said insulating film heating step, in order to produce viscous flow around the substrate, a nitrogen gas is supplied such that a gas flow rate of the supplied nitrogen gas around the substrate is in a range of 500 to 3000 SCCM and a pressure around the substrate is set to a range of 6.7×

    10 to 1.3×

    102 Pa, andwherein molecules vaporized from a product which is produced in said insulating film exposure step are discharged by using the produced viscous flow.

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