Semiconductor processing system with ultra low-K dielectric
First Claim
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1. A semiconductor processing system with ultra low-K dielectric comprising:
- providing a substrate having an electronic circuit;
forming an ultra low-K dielectric layer, having porogens, over the substrate;
applying a photoresist layer on the ultra low-K dielectric layer;
blocking an incoming radiation from a first region of the ultra low-K dielectric layer;
evaporating the porogens from a second region of the ultra low-K dielectric layer by projecting the incoming radiation on the second region; and
removing the ultra low-K dielectric layer and the photoresist layer in the first region with a developer.
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Abstract
A semiconductor processing system with ultra low-K dielectric is provided including providing a substrate having an electronic circuit, forming an ultra low-K dielectric layer, having porogens, over the substrate, blocking an incoming radiation from a first region of the ultra low-K dielectric layer, evaporating the porogens from a second region of the ultra low-K dielectric layer by projecting the incoming radiation on the second region, and removing the ultra low-K dielectric layer in the first region with a developer.
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Citations
10 Claims
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1. A semiconductor processing system with ultra low-K dielectric comprising:
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providing a substrate having an electronic circuit; forming an ultra low-K dielectric layer, having porogens, over the substrate; applying a photoresist layer on the ultra low-K dielectric layer; blocking an incoming radiation from a first region of the ultra low-K dielectric layer; evaporating the porogens from a second region of the ultra low-K dielectric layer by projecting the incoming radiation on the second region; and removing the ultra low-K dielectric layer and the photoresist layer in the first region with a developer. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor processing system with ultra low-K dielectric comprising:
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providing a substrate having an electronic circuit; forming an ultra low-K dielectric layer, having porogens, over the substrate including forming an insulator on a conductive material; applying a photoresist layer on the ultra low-k dielectric layer including patterning a first region; blocking an incoming radiation from a first region of the ultra low-K dielectric layer including blocking the incoming radiation using a photoresist mask or a reticle; evaporating the porogens from a second region of the ultra low-K dielectric layer by projecting the incoming radiation on the second region to form a nanopore; and removing the porogens from the ultra low-K dielectric layer includes selectively removing the first region from the ultra low-K dielectric layer and the photo resist with a developer. - View Dependent Claims (7, 8, 9, 10)
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Specification