Pixel structure having an umbrella type absorber with one or more recesses or channels sized to increase radiation absorption

• US 7,622,717 B2
• Filed: 12/03/2007
• Issued: 11/24/2009
• Est. Priority Date: 08/22/2007
• Status: Active Grant

• Current Assignee: DRS Network & Imaging Systems, LLC (Leonardo S.p.A.)
• Original Assignee: DRS Sensors & Targeting Systems, Inc. (Leonardo S.p.A.)
• Inventors: Skidmore, George D., Howard, Christopher G.
• Primary Examiner(s): Porta; David P
• Assistant Examiner(s): LEE, SHUN K
• Application Number:
  US11/949,367
• Publication Number:
  US 20090140147A1
• Time in Patent Office: 722 Days
• Field of Search: 250/338.1
• US Class Current: 250/338.1
• CPC Class Codes: G01J 5/0225 Shape of the cavity itself or of elements contained in or suspended over the cavity
• CPC Class Codes: G01J 5/046 Materials; Selection of thermal materials
• CPC Class Codes: G01J 5/0853 having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14669 Infrared imagers

Abstract

A pixel structure for use in an infrared imager is provided. The pixel structure includes a substrate and a bolometer. The bolometer includes a transducer that has a spaced apart relationship with respect to the substrate and has an electrical resistance that varies in response to changes in the temperature of the transducer. The bolometer also includes an absorber that has a spaced apart relationship with respect to the transducer and has a thermal connection to the transducer permitting radiation absorbed by the absorber to heat the transducer. The absorber has a top side defining a recess or channel in the absorber. The recess or channel is adapted to effect the propagation path of a portion of radiation received by the absorber such that the radiation portion is absorbed by the absorber rather than exiting the absorber. The recess or channel also decreases the thermal mass of the bolometer.

Claims

1. A pixel structure for use in an infrared imager, comprising:

a substrate; and

a bolometer comprising;

a transducer having a spaced apart relationship with respect to said substrate, the transducer having an electrical resistance that varies in response to changes in the temperature of the transducer, and

an absorber having a spaced apart relationship with respect to the transducer, the absorber having a thermal connection to the transducer permitting radiation absorbed by the absorber to heat the transducer, the absorber including an absorbing layer having a thickness that is 100 Angstroms or less, the absorber further including a base layer disposed below the absorbing layer and having a thickness equal to or greater than 900 Angstroms,

wherein the absorber has a top side defining a channel through the absorber, the channel being adapted to affect the propagation path of a portion of radiation received by the absorber such that the radiation portion is absorbed by the absorber rather than exiting the absorber.

2. A pixel structure according to claim 1, wherein radiation portion corresponds to a predetermined wavelength and the channel has a width that is smaller than the predetermined wavelength.

3. A pixel structure according to claim 1, wherein the bolometer further comprises a reflector disposed over the substrate and below the transducer, wherein the channel is disposed relative to the reflector such that the channel effects the propagation path of radiation reflected by the reflector towards the absorber so that the reflected radiation is absorbed by the absorber rather than exiting the absorber.

4. A pixel structure according to claim 1, wherein the channel effectively increases the resistivity of the absorber to a predetermined level.

5. A pixel structure according to claim 1, wherein the absorber covers the transducer in an umbrella type configuration.

6. A pixel structure according to claim 1, wherein the channel is one of a plurality of channels through the absorber.

7. A pixel structure according to claim 6, wherein the channels are spaced about a center of the absorber.

8. A pixel structure according to claim 1, wherein the thickness of the absorbing layer is in a range from 50 Angstroms to 100 Angstroms.

9. A pixel structure according to claim 1, wherein the channel is one of a plurality of channels through the absorber and spaced about the absorber such that the absorbing layer has a sheet resistance within the range of 350 ohms per square to 1000 ohms per square.

10. A pixel structure according to claim 1, wherein the channel is one of a plurality of channels through the absorber and the channels collectively displace a third or more of a volume of the absorbing layer.

11. A pixel structure according to claim 1, wherein the channel is one of a plurality of channels in the absorber and the collective density of the channels is selected such that the absorber has a sheet resistance that is equal to or greater than 400 ohms per square.

12. A pixel structure according to claim 1, wherein the bolometer further comprises a post extending between the transducer and the base layer of the absorber for supporting the absorber in the spaced apart relationship with the transducer.

13. A pixel structure according to claim 1, wherein the absorbing layer comprises NiCr.

14. A pixel structure for use in an infrared imager, comprising:

a substrate; and

a bolometer comprising;

a transducer having a spaced apart relationship with respect to said substrate, the transducer having an electrical resistance that varies in response to changes in the temperature of the transducer, and

an absorber having a spaced apart relationship with respect to the transducer, the absorber having a thermal connection to the transducer permitting radiation absorbed by the absorber to heat the transducer, the absorber including an absorbing layer having a thickness that is 100 Angstroms or less, the absorber further including a rigid base layer disposed below the absorbing layer and having a thickness equal to or greater than 900 Angstroms,

wherein the absorber has a top side defining a channel through the absorber, the channel being adapted to decrease the thermal mass of the absorber.

15. The pixel structure of claim 14, wherein the reduction in thermal mass results in a faster thermal time constant for the bolometer.