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Heat sink assembly and related methods for semiconductor vacuum processing systems

  • US 7,622,803 B2
  • Filed: 08/24/2006
  • Issued: 11/24/2009
  • Est. Priority Date: 08/30/2005
  • Status: Active Grant
First Claim
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1. An assembly for supporting a substrate during vacuum processing operations, comprising:

  • a thermally conductive heat sink tray including at least one wafer pocket recessed therein;

    a thermally conductive heat sink carrier in the at least one wafer pocket, the heat sink carrier including a first surface in contact with a surface within the at least one wafer pocket and a second surface opposite the first surface; and

    a heat sink on the second surface of the heat sink carrier.

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