Smart blister pack

• US 7,623,040 B1
• Filed: 10/16/2006
• Issued: 11/24/2009
• Est. Priority Date: 11/14/2005
• Status: Expired due to Fees

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Inventors: Cote, Andre
• Primary Examiner(s): Previl; Daniel
• Application Number:
  US11/549,795
• Time in Patent Office: 1,135 Days
• Field of Search: 340/572.8, 3405721-5727, 340/572.9, 206/531, 206/534.1, 206/469, 206/528, 206/530, 206/532, 206/534, 206/538, 206/539, 206/471
• US Class Current: 340/572.8
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2445 Tag integrated into item to be protected, e.g. source tagging

Abstract

A blister pack having at least one security tag formed from the metal layer of the blister pack. In one embodiment, the security tag is a detached portion of the metal layer that is entrenched in a corresponding channel in the plastic layer of the blister pack and which is then completed by electrically coupling a capacitor strap or chip strap to a gapped portion of the entrenched aluminum layer. Another embodiment also forms the security tag from the metal layer but the coil or antenna of the security tag is formed as part of the process of sealing the metal layer to the plastic layer. A capacitor strap or chip strap is then electrically coupled to a gapped portion of the coil or antenna.

Claims

1. A blister pack comprising:

a non-conductive layer comprising a plurality of compartments holding respective elements and located substantially within a central region of said non-conductive layer, said non-conductive layer further comprising a channel running through a margin region that surrounds said central region;

a metal layer that is sealed over said central region for securing said elements within said plurality of compartments; and

a security tag positioned within said channel, said security tag comprising;

a metal material that has been separated from said metal layer within said channel and wherein said metal material comprises a gap and wherein a radio frequency identification (RFID) circuit is electrically coupled across said gap.

2. The blister pack of claim 1 wherein said metal layer comprises aluminum.

3. The blister pack of claim 2 wherein said RFID integrated circuit comprises a chip strap.

4. The blister pack of claim 1 wherein said non-conductive layer comprises polystyrene.

5. The blister pack of claim 1 wherein said metal material comprises a second gap to form a dipole.

6. The blister pack of claim 1 wherein said RFID integrated circuit comprises a chip strap.

7. A blister pack comprising:

a non-conductive layer comprising a plurality of compartments holding respective elements and located substantially within a central region of said non-conductive layer, said non-conductive layer further comprising at least one loop channel running through a margin region that surrounds said central region;

a metal layer that is sealed over said central region and said margin region for securing said elements within said plurality of compartments; and

a security tag positioned within said at least one loop channel and comprising

a metal material therein, said metal material being separated from said metal layer and comprising at least one loop corresponding to said at least one loop channel, and wherein said separated metal material comprises a gap across which a capacitor is electrically coupled.

8. The blister pack of claim 7 wherein said capacitor comprises a capacitor strap.

9. A method for integrating a security tag in a blister pack having a non-conductive layer having a plurality of compartments holding respective elements therein and located substantially within a central region of the non-conductive layer and wherein a metal layer is sealed over the non-conductive layer, said method comprising:

forming at least one channel in a margin region of said non-conductive layer surrounding the central region before the metal layer is sealed over the non-conductive layer;

sealing the metal layer over the non-conductive layer;

severing a portion of the metal layer that is positioned over said at least one channel;

disposing said severed portion within said at least one channel;

creating a first gap and a second gap in said severed portion; and

electrically coupling or a radio frequency identification (RFID) integrated circuit across only one of said two gaps.

10. The method of claim 9 wherein said RFID integrated circuit comprises a chip strap.

11. The method of claim 9 wherein said step of creating a first and second gaps said severed portion comprises:

severing a predetermined portion from said metal layer; and

applying a vacuum to said severed predetermined portion to remove said severed predetermined portion from said channel.

12. The method of claim 9 wherein said step of forming at least one channel in a margin region further comprises forming a recess in said non-conductive layer that is adjacent said at least one channel and wherein said step of creating a gap in a portion of said severed portion comprises:

severing a predetermined portion from said metal layer; and

displacing said severed predetermined portion into said recess to remove said severed predetermined portion from said channel.

13. A blister pack comprising:

a non-conductive layer comprising a plurality of compartments holding respective elements and located substantially within a central region of said non-conductive layer, said non-conductive layer comprising a margin region that surrounds said central region;

a metal layer that is sealed over said central region for securing said elements within said plurality of compartments; and

a security tag formed within said margin region, said security tag comprising;

a metal material that has been separated from said metal layer of and wherein said metal material comprises a gap therein; and

a radio frequency identification (RFID) integrated circuit coupled across said gap.

14. The blister pack of claim 13 wherein said separated metal material comprises a second gap to form a dipole.

15. The blister pack of claim 13 wherein said metal layer comprises aluminum.

16. The blister pack of claim 13 wherein said non-conductive layer comprises polystyrene.

17. The blister pack of claim 13 wherein said RFID integrated circuit comprises a chip strap.

18. A method of producing a blister pack comprising an integrated security tag or inlay formed of a metal layer and wherein the blister pack comprises non-conductive layer having a plurality of compartments holding respective elements therein and located substantially within a central region of the non-conductive layer and defining a margin region surrounding said central region, said method comprising:

applying a patterned adhesive to said margin region of said non-conductive layer and to said central region, said patterned adhesive applied in said margin region having the form of at least one loop having two respective ends;

applying a metal layer to said non-conductive layer having said patterned adhesive thereon;

cutting said metal layer in said form of at least one loop having two respective ends to form a coil or antenna in said margin region;

removing all portions of said metal layer that are not coupled to said non-conductive layer by any portion of said patterned adhesive; and

coupling a capacitor across a gap in said at least one loop.

19. The method of claim 18 wherein said RFID integrated capacitor is a capacitor strap.

20. A method for integrating a security tag in a blister pack having a non-conductive layer having a plurality of compartments holding respective elements therein and located substantially within a central region of the non-conductive layer and wherein a metal layer is sealed over the non-conductive layer, said method comprising:

forming at least one loop channel in a margin region of said non-conductive layer surrounding the central region before the metal layer is sealed over the non-conductive layer;

sealing the metal layer over the non-conductive layer;

severing a portion of the metal layer that is positioned over said at least one loop channel to form an at least one loop from said severed portion of said metal layer

disposing said severed portion within said multi-turn channel;

creating gap in a portion of said severed portion; and

electrically coupling a capacitor across said gap to form a security tag positioned within said at least one loop channel.

21. The method of claim 20 wherein said step of creating a gap comprises a gap formed between two ends of said multi-turn coil.

22. A method of producing a blister pack comprising an integrated security tag or inlay formed of a metal layer and wherein the blister pack comprises non-conductive layer having a plurality of compartments holding respective elements therein and located substantially within a central region of the non-conductive layer and defining a margin region surrounding said central region, said method comprising:

applying a patterned adhesive to said margin region of said non-conductive layer and to said central region, said patterned adhesive applied in said margin region having the form of at least one loop;

applying a metal layer to said non-conductive layer having said patterned adhesive thereon;

cutting said metal layer in said form of at least one loop having a gap therein to form an antenna in said margin region;

removing all portions of said metal layer that are not coupled to said non-conductive layer by any portion of said patterned adhesive; and

coupling a radio frequency identification (RFID) integrated circuit across said gap.

23. The method of claim 22 wherein said step of creating a gap further comprises creating a second gap to form a dipole.

24. The method of claim 22 wherein said RFID integrated circuit comprises a chip strap.