Hermetic feedthrough terminal assembly with wire bond pads for human implant applications
First Claim
Patent Images
1. A feedthrough terminal assembly for an active implantable medical device, comprising:
- a conductive terminal pin extending through a housing for the active implantable medical device in non-conductive relation;
a non-conductive insulator disposed between the terminal pin and the housing; and
a wire bond pad conductively coupled to a portion of the terminal pin on a body fluid side of the assembly, the wire bond pad adapted to have a lead wire conductively attached thereto.
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Accused Products
Abstract
A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.
100 Citations
58 Claims
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1. A feedthrough terminal assembly for an active implantable medical device, comprising:
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a conductive terminal pin extending through a housing for the active implantable medical device in non-conductive relation; a non-conductive insulator disposed between the terminal pin and the housing; and a wire bond pad conductively coupled to a portion of the terminal pin on a body fluid side of the assembly, the wire bond pad adapted to have a lead wire conductively attached thereto. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58)
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Specification