Direct-manufactured duct interconnects

• US 7,623,940 B2
• Filed: 06/02/2006
• Issued: 11/24/2009
• Est. Priority Date: 06/02/2006
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Bagwill, Tracy L., Huskamp, Chris
• Primary Examiner(s): Patel; Ramesh B
• Application Number:
  US11/422,052
• Publication Number:
  US 20070278794A1
• Time in Patent Office: 1,271 Days
• Field of Search: 700 97- 98, 700117-118, 700/154, 700/163, 700/182, 285/180, 285/197, 285/199, 285/331, 285/363, 285/364, 295/92, 439100-102, 439/208, 439/799, 406/86, 406/191, 703/1, 138/111, 138/113, 174/72.R, 174/98
• US Class Current: 700/154
• CPC Class Codes: B22F 10/12 by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
• CPC Class Codes: B22F 10/28 Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
• CPC Class Codes: B22F 5/106 Tube or ring forms
• CPC Class Codes: B22F 7/062 involving the connection or repairing of preformed parts
• CPC Class Codes: B28B 1/00 Producing shaped prefabricated articles from the material using presses B28B3/00; shaping on moving conveyors B28B5/00; producing tubular articles B28B21/00 ; producing articles with embedded elements B28B23/00
• CPC Class Codes: B28B 1/001 Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: Y02P 10/25 Process efficiency

Abstract

A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.

Claims

1. A method for forming a duct connector, the method comprising:

providing a first digital model of a first duct structure, the first duct structure including a first duct section having a passage for conveying a substance, and a first interconnect component moveably and captively coupled to the duct section;

providing a second digital model of second duct structure, the second duct structure including a second duct section having a passage for conveying the substance, and a second interconnect component, wherein the second interconnect component is configured to removeably enter a locked state with the first interconnect component such that, when said second interconnect component is in the locked state, a sealing force between the first and second duct structures is substantially equal to a predetermined value;

forming, via a direct manufacturing procedure, a first physical model corresponding to the first duct structure defined by the first digital model; and

forming, via the direct manufacturing procedure, a second physical model corresponding to the second duct structure defined by the second digital model.

2. The method of claim 1, further including forming a secondary locking mechanism on said first interconnect component.

3. The method of claim 1, wherein the physical model is formed from a material selected from the group consisting of plastics, metals, ceramics, and composites.

4. The method of claim 1, wherein the direct manufacturing procedure is a layering method.

5. The method of claim 4, wherein the layering method is a method selected from the group consisting of stereolithography, selective sintering, metal additive processing, and laminated object manufacturing.

6. The method of claim 1, wherein the first interconnect component is captively coupled to the first duct section such that said first interconnect component exhibits two degrees of freedom with respect to the duct section.

7. The method of claim 6, wherein the two degrees of freedom correspond to a sliding degree of freedom parallel to a longitudinal axis of the duct section;

and a rotational degree of freedom about the longitudinal axis of the duct section.

8. The method of claim 1, wherein the first duct section has a circular cross-section.

9. The method of claim 1, wherein:

the second interconnect component includes at least one external pin; and

the first interconnect component includes;

a slot configured to accept the external pin when the first interconnect component is moved parallel to the longitudinal axis; and

a detent configured to accept the external pin when the first interconnect component is subsequently rotated about the longitudinal axis to enter the locked state.

10. The method of claim 1, wherein the first interconnect component is captively coupled to the first duct section via at least one collar stop integral to the first duct section, and wherein the first interconnect component includes a collar configured to seat adjacent the collar stop.

11. The method of claim 1, wherein the first duct section includes a male alignment feature and the second duct section is configured to receive the male alignment feature.

12. The method of claim 1, wherein the first interconnect structure and the second interconnect structure each include at least one grip structure.