High density in-package microelectronic amplifier
First Claim
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1. A sensor module comprising:
- a package substrate formed of layers of material and having a first surface with an open cavity,a sensor disposed within the cavity, the sensor for providing signals,first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor,an amplifier disposed within the cavity for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of the package substrate,electrical connections disposed on the surface of the package substrate for receiving the buffered signals from the second electrical traces, anda lid disposed on the first surface of the package substrate for covering at least the buffer and the amplifier.
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Abstract
A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.
21 Citations
20 Claims
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1. A sensor module comprising:
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a package substrate formed of layers of material and having a first surface with an open cavity, a sensor disposed within the cavity, the sensor for providing signals, first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor, an amplifier disposed within the cavity for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of the package substrate, electrical connections disposed on the surface of the package substrate for receiving the buffered signals from the second electrical traces, and a lid disposed on the first surface of the package substrate for covering at least the buffer and the amplifier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A sensor module comprising:
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a package substrate formed of layers of material and having a first surface with an open cavity, a sensor disposed within the cavity, the sensor for providing signals, first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor, an amplifier assembly disposed within the cavity for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of the package substrate, the amplifier assembly comprising a substrate for receiving the signals from the first electrical traces, providing the signals to amplifiers mounted on the substrate, and for receiving the amplified signals from the amplifiers, electrical connections disposed on the surface of the package substrate for receiving the buffered signals from the second electrical traces, and a lid disposed on the first surface of the package substrate for covering at least the buffer and the amplifier assembly. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A sensor module comprising:
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a package substrate formed of layers of material and having a first surface, a sensor disposed within a first cavity in the first surface, the sensor for providing signals, a buffer capacitor disposed within a second cavity in the first surface for buffering the sensor, first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor, an amplifier assembly disposed within a third cavity in the first surface for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of the package substrate, the amplifier assembly comprising a substrate for receiving the signals from the first electrical traces, providing the signals to amplifiers mounted on the substrate, and for receiving the amplified signals from the amplifiers, electrical connections disposed on the first surface of the package substrate for receiving the buffered signals from the second electrical traces, and a lid disposed on the first surface of the package substrate for covering at least the second cavity and the third cavity. - View Dependent Claims (20)
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Specification