MEMS device and assembly method

• US 7,628,875 B2
• Filed: 09/12/2006
• Issued: 12/08/2009
• Est. Priority Date: 09/12/2006
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Knaapen, Raymond Jacobus, Nijsse, Gerard Johannes Pieter, Bex, Jan, Kums, Gerard
• Primary Examiner(s): Nguyen; Khanh
• Assistant Examiner(s): BLADES, JOHN A
• Application Number:
  US11/519,204
• Publication Number:
  US 20080063830A1
• Time in Patent Office: 1,183 Days
• Field of Search: 156/64, 427/98.4, 427/9, 427/8
• US Class Current: 156/64
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: B81C 3/001 Bonding of two components
• CPC Class Codes: Y10T 428/20 Patched hole or depression
• CPC Class Codes: Y10T 428/218 Aperture containing
• CPC Class Codes: Y10T 428/219 Edge structure
• CPC Class Codes: Y10T 428/249953 Composite having voids in a component [e.g., porous, cellular, etc.]

Abstract

A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.

Claims

1. A method of bonding a MEMS device to a substrate to form a MEMS device assembly, the method comprising:

determining at least one of a thickness profile of the MEMS device and a flatness of a mating surface of the substrate;

depositing adhesive onto at least one of a mating surface of the MEMS device and the mating surface of the substrate; and

bringing the mating surfaces of the MEMS device and substrate together, such that the adhesive bonds the MEMS device to the substrate,

wherein a volume of the adhesive deposited at respective locations on one or both of the mating surfaces is selected to compensate for local variations in the thickness profile of the MEMS device or the flatness of the mating surface of the substrate.

2. The method of claim 1, further comprising:

forming an active surface on the MEMS device, the active surface opposing the mating surface and a size of droplets of the adhesive are selected, such that the active surface of the MEMS device is provided with an improved flatness after bonding.

3. The method of claim 1, wherein the determining step comprises measuring the thickness profile of the MEMS device or the flatness of the mating surface of the substrate using 3D deflectometry.

4. The method of claim 1, wherein the depositing step comprises depositing the adhesive in a series of spaced apart droplets, a volume of each of the droplets being selected to compensate for local variations in the thickness profile of the MEMS device or the flatness of the mating surface of the substrate.

5. The method of claim 1, wherein the mating surface of the substrate is divided into a plurality of regions, and the method further comprises:

calculating a volume of the adhesive in each region to compensate for local variations in the thickness profile of the MEMS device or the flatness of the mating surface of the substrate.

6. The method of claim 5, wherein the depositing step comprises depositing the adhesive in a series of droplets, such that a volume of each of the droplets corresponds to a respective one of the calculated volumes.

7. The method of claim 5, further comprising separating adjacent regions on the mating surface of the substrate using a recess.

8. The method of claim 5, further comprising surrounding each region using recesses.

9. The method of claim 1, further comprising:

applying pressure to urge the mating surfaces of the MEMS device and the substrate together during bonding.

10. The method of claim 9, further comprising applying the pressure through suction of the MEMS device onto the mating surface of the substrate.

11. The method of claim 10, further comprising:

providing the substrate with at least one conduit having an opening on the substrate mating surface; and

extracting air through the conduit so as to urge the MEMS device onto the substrate.