RFID temperature sensing wafer, system and method
First Claim
1. A method of manufacturing semiconductor wafers comprising:
- processing a semiconductor wafer to form at least one temperature-sensing RF device on the wafer;
further processing the wafer to form a plurality of semiconductor products on the wafer; and
during the further processing of the wafer, sensing temperature at locations on the wafer corresponding to each of the at least one RF device and wirelessly transmitting data, including temperature data, from the at least one RF device.
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Accused Products
Abstract
A method of manufacturing semiconductor wafers is provided that comprises processing a semiconductor wafer to form at least one temperature-sensing RF device on the wafer and further processing the wafer to form a plurality of semiconductor products on the wafer while sensing temperature on the wafer with the formed RF device and wirelessly transmitting data from the RF device. Semiconductor wafers made according to the method are provided having at least one active RFID temperature-sensing device and semiconductor device products formed thereon. The RFID devices are located on portions of the wafer that are disposable when the semiconductor device products are cut from the wafers. A semiconductor wafer processing apparatus is provided having an RF antenna and transmitter and receiver circuits that communicate with RF devices on a wafer during processing.
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Citations
23 Claims
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1. A method of manufacturing semiconductor wafers comprising:
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processing a semiconductor wafer to form at least one temperature-sensing RF device on the wafer; further processing the wafer to form a plurality of semiconductor products on the wafer; and during the further processing of the wafer, sensing temperature at locations on the wafer corresponding to each of the at least one RF device and wirelessly transmitting data, including temperature data, from the at least one RF device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification