Method of producing acceleration sensor chip package

• US 7,629,193 B2
• Filed: 12/27/2007
• Issued: 12/08/2009
• Est. Priority Date: 10/22/2004
• Status: Expired due to Fees

• Current Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Original Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Inventors: Ichikawa, Shunji
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US12/005,370
• Publication Number:
  US 20080131989A1
• Time in Patent Office: 712 Days
• Field of Search: 735/140.1, 735/143.3, 735/143.8, 438/51
• US Class Current: 438/51
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

Claims

1. A method of producing an acceleration sensor chip package, comprising the steps of:

preparing a semiconductor substrate having a plurality of acceleration sensors arranged in a matrix pattern, each of said acceleration sensors having an electrode pad and a movable structure disposed in an opening portion;

attaching a substrate to a lower surface of the semiconductor substrate;

forming a re-wiring layer extending on the semiconductor substrate outside the opening portions and having a plurality of wiring portions, each of said wiring portions having one end electrically connected to each of the electrode pads;

forming a plurality of outer terminals on the semiconductor substrate outside the opening portions, each of said outer terminals being connected to the other end of each of the wiring portions;

forming a plurality of conductive bumps connected to the electrode pads;

attaching a sensor control chip having a first surface and a second surface opposite to the first surface, said sensor control chip having, sensor control electrode pads connected to the electrode pads;

forming a sealing portion over the acceleration sensors for sealing the sensor control chip, the electrode pads, and the re-wiring layer such that the outer terminals are exposed from the sealing portion; and

cutting the sealing portion, the semiconductor substrate, and the substrate situated between the acceleration sensors to obtain the acceleration sensor chip package as a piece.

2. The method of producing an acceleration sensor chip package according to claim 1, further comprising the step of forming a resin ring portion surrounding the opening portions and closely contacting with the first surface of the sensor control chip.

3. The method of producing an acceleration sensor chip package according to claim 1, wherein, in the step of forming the sealing portion, said sealing portion covers side surfaces of the conductive bumps.

4. The method of producing an acceleration sensor chip package according to claim 1, wherein, in the step of attaching the sensor control chip, said sensor control electrode pads are disposed on the first surface so that the first surface faces the acceleration sensors.

5. The method of producing an acceleration sensor chip package according to claim 1, wherein, in the step of attaching the sensor control chip, said sensor control chip is disposed so that the outer terminals protrude beyond the second surface.