Patch antenna with electromagnetic shield counterpoise

• US 7,629,928 B2
• Filed: 03/23/2005
• Issued: 12/08/2009
• Est. Priority Date: 03/23/2005
• Status: Expired due to Fees

• Current Assignee: Hanei Corp. (Sapporo Holdings Limited)
• Original Assignee: Kyocera Wireless Corporation (Kyocera Corporation)
• Inventors: Fabrega-Sanchez, Jorge, Sitachitt, Sidney, Poynot, Andrew Stephen
• Primary Examiner(s): MANCUSO, HUEDUNG XUAN CAO
• Application Number:
  US11/087,171
• Publication Number:
  US 20060214849A1
• Time in Patent Office: 1,721 Days
• Field of Search: 343/700.MS, 343/702, 343/841
• US Class Current: 343/700.0MS
• CPC Class Codes: G02B 27/62 Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 1/526 Electromagnetic shields
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

A patch antenna includes a radiating element positioned on one side of a printed circuit board and an electromagnetic shield positioned on the opposite side of the printed circuit board. The electromagnetic shield forms at least a portion of a counterpoise and is connected to the ground of the PCB in at least one location. Design flexibility in positioning the antenna within a portable communication device is maximized while the size of the portable communication device is minimized.

Claims

1. A patch antenna comprising:

a radiating element positioned on a first side of a printed circuit board; and

an electromagnetic shield mounted on an opposite side of the printed circuit board to position the electromagnetic shield within a perimeter of the printed circuit board and forming at least a portion of a counterpoise of the patch antenna.

2. A patch antenna in accordance with claim 1, wherein the counterpoise of the antenna comprises the electromagnetic shield and a ground of the printed circuit board.

3. A patch antenna in accordance with claim 1, wherein the radiating element is positioned at least partially over an opening within the printed circuit board exposing at least a portion of the electromagnetic shield.

5. A patch antenna in accordance with claim 1, wherein the electromagnetic shield is soldered to a ground of the printed circuit board.

6. A patch antenna in accordance with claim 5, wherein the electromagnetic shield comprises four sides and is soldered to the ground along at least a portion of at least one of the sides.

7. A patch antenna in accordance with claim 6, wherein the electromagnetic shield is soldered to the ground along at least a portion of only one of the sides.

8. A patch antenna in accordance with claim 1, wherein the electromagnetic shield further comprises a top surface that is offset from the opposite surface of the printed circuit board.

4. A patch antenna in accordance with 1, wherein the radiating element and the electromagnetic shield at least partially form a planar inverted “

F”

antenna (PIFA).

9. A patch antenna comprising:

a printed circuit board having a first side and a second side;

a planar radiating element connected to the first side of the printed circuit board and positioned at least partially over an opening in the printed circuit board; and

an electromagnetic shield connected to the second side of the printed circuit board and positioned at least partially under the opening and within a perimeter of the printed circuit board, the electromagnetic shield forming at least a portion of a counterpoise of the patch antenna.

10. A patch antenna in accordance with claim 9, wherein the electromagnetic shield comprises four sides and at least a portion of one side is soldered to a conductive ground layer of the printed circuit board.

11. A patch antenna in accordance with claim 10, wherein at least a portion of only one side is soldered to the conductive ground layer.

12. A patch antenna in accordance with claim 10, wherein at least a portion of at least two sides are soldered to the conductive ground layer.

13. A patch antenna in accordance with claim 12, wherein at least a portion of at least three sides are soldered to the conductive ground layer.

14. A patch antenna in accordance with claim 9, wherein the electromagnetic shield comprises a plurality of sides and a top surface that is offset from the opposite surface of the printed circuit board, each side connected between the top surface and the opposite surface of the printed circuit board.

15. A patch antenna in accordance with claim 9, wherein the radiating element and the electromagnetic shield at least partially form a planar inverted “

F”

antenna (PIFA).

16. A patch antenna in accordance with claim 15, wherein the PIFA is a multiband PIFA.

17. A patch antenna in accordance with claim 16, wherein the PIFA is optimized to operate in a frequency band of 824-894 MHZ, in a frequency band of 1850-1990 MHZ and a frequency band including 1575 MHZ.

18. A mobile communication device assembly comprising:

a printed circuit board having a first side and a second side;

a plurality of electrical components mounted to the printed circuit board;

a planar radiating element connected to the first side of the printed circuit board and positioned at least partially over an opening in the printed circuit board; and

an electromagnetic shield connected to the second side of the printed circuit board and positioned at least partially under the opening and within a perimeter of the printed circuit board, the planar radiating element and the electromagnetic shield forming at least a portion of a patch antenna.

19. A mobile communication device assembly in accordance with claim 18, wherein the electromagnetic shield comprises a top surface and four planar sides positioned between the top surface and the second side of the printed circuit board and at least a portion of an edge of one planar side is soldered to conductive ground layer of the printed circuit board.

20. A mobile communication device assembly in accordance with claim 19, wherein at least portions of each of at least two sides of the electromagnetic shield are soldered to the conductive ground layer.