Apparatus and method for reducing slippage between structures in an interferometric modulator

• US 7,630,119 B2
• Filed: 08/12/2005
• Issued: 12/08/2009
• Est. Priority Date: 09/27/2004
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Floyd, Philip D., Cummings, William J., Tung, Ming-Hau, Arbuckle, Brian W.
• Primary Examiner(s): Schwartz; Jordan M.
• Assistant Examiner(s): JONES, JAMES
• Application Number:
  US11/203,613
• Publication Number:
  US 20060067649A1
• Time in Patent Office: 1,579 Days
• Field of Search: 359/290, 359/291
• US Class Current: 359/290
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

Claims

1. A microelectromechanical systems (MEMS) device, comprising:

a substrate layer comprising a first reflective surface and a transparent substrate underlying the first reflective surface, the first reflective surface being partially transmissive, the first reflective surface formed on the transparent substrate;

a movable layer comprising a second reflective surface, the second reflective surface being spaced from the first reflective surface to thereby define an interferometric cavity;

a support structure positioned at a side of the cavity and configured to separate at least a portion of the substrate layer from at least a portion of the moveable layer; and

a roughened interface between a surface of the support structure and a surface of the substrate layer connected to the surface of the support structure, the roughened interface being configured to increase adhesion between the support structure and the substrate layer.

2. The MEMS device of claim 1, comprising an interferometric modulator.

3. The MEMS device of claim 1, wherein the roughened interface comprises a roughened surface of the support structure.

4. The MEMS device of claim 1, wherein the roughened interface comprises a roughened surface of the first reflective surface.

5. The MEMS device of claim 1, wherein the second reflective surface is suspended from the moveable layer.

6. The MEMS device of claim 1, further comprising an adhesive layer disposed at the roughened interface and connected to the support structure and the substrate layer.

7. The MEMS device of claim 6, wherein the adhesive layer comprises aluminum.

8. The MEMS device of claim 6, wherein the adhesive layer is connected to the support structure and the transparent substrate.

9. The MEMS device of claim 6, wherein the adhesive layer is connected to the support structure and the first reflective surface.

13. A display device comprising the interferometric modulator of claim 2.

14. The display device of claim 13, further comprising:

a display;

a processor that is in electrical communication with the display, the processor being configured to process image data;

a memory device in electrical communication with the processor.

15. The display device of claim 14, further comprising:

a driver circuit configured to send at least one signal to the display.

16. The display device of claim 15, further comprising:

a controller configured to send at least a portion of the image data to the driver circuit.

17. The display device of claim 14, further comprising:

an image source module configured to send the image data to the processor.

18. The display device of claim 17, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

19. The display device of claim 14, further comprising:

an input device configured to receive input data and to communicate the input data to the processor.

20. The MEMS device of claim 1, wherein the roughened interface comprises an etched surface of the support structure.

21. The MEMS device of claim 1, wherein the roughened interface comprises an etched surface of the substrate layer.

24. The device of claim 1, wherein the roughened interface comprises a roughened surface of the transparent substrate.

25. The device of claim 1, wherein the roughened interface comprises a roughened surface of the transparent substrate and a roughened surface of the support structure.

26. The device of claim 1, wherein the roughened interface comprises a roughened surface of the support structure and a roughened surface of the first reflective surface.

10. An interferometric modulator comprising:

means for interferometrically modulating light, the modulating means comprising a fixed layer and a movable layer spaced apart from the fixed layer, the fixed layer comprising a first reflective surface formed on a transparent substrate, the first reflective surface being partially transmissive, the movable layer comprising a second reflective surface;

means for supporting the moveable layer over the fixed layer; and

means for bonding the support means to the fixed layer, the bonding means being formed on the fixed layer and comprising a roughened interface configured to increase adhesion between the supporting means and the fixed layer.

11. The interferometric modulator of claim 10, wherein the bonding means further comprises an adhesive.

12. The interferometric modulator of claim 10, wherein the support means comprises a post.

22. The MEMS device of claim 10, wherein the roughened interface comprises an etched surface of the support means.

23. The MEMS device of claim 10, wherein the roughened interface comprises an etched surface of the fixed layer.