Conditioner with coplanar conductors

• US 7,630,188 B2
• Filed: 02/27/2006
• Issued: 12/08/2009
• Est. Priority Date: 03/01/2005
• Status: Active Grant

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, William M.
• Primary Examiner(s): Jackson; Stephen W
• Assistant Examiner(s): BROOKS, ANGELA D
• Application Number:
  US11/817,639
• Publication Number:
  US 20080266741A1
• Time in Patent Office: 1,380 Days
• Field of Search: 361/118, 361/111, 205/462, 324/133
• US Class Current: 361/118
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Disclosed are novel internal structures of energy conditioners (3a-3k) having A, B, and G master electrodes, novel assemblies of internal structures and internal structures of energy conditioners having A, B, and G electrodes, and novel arrangements of energy conditioners having A, B, and G master electrodes on connection structures.

Claims

1. An internal structure of an energy conditioner:

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein said internal structure comprises a dielectric material and a conductive material;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer, a first B conductive layer, and a first G conductive layer in a first plane;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab and a first A conductive layer main body portion;

wherein said first B conductive comprises at least one first B conductive layer first tab and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive layer first tab, a first G conductive layer second tab, and a first G conductive layer main body portion;

wherein said first A conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first B conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first G conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface; and

wherein said first G conductive layer is between said A conductive layer and said B conductive layer.

2. An energy conditioner comprising the structure of claim 1 and an energy conditioner external structure.

3. An assembly comprising the energy conditioner of claim 2 mounted on mounting surface structure, wherein said mounting surface structure consists of a first conductive region, a second conductive region, and a third conductive region;

wherein said first A conductive layer conductively connects to said first conductive region;

wherein said first B conductive layer conductively connects to said second conductive region; and

wherein said G conductive layer conductively connects to said third conductive region.

4. The assembly of claim 3 wherein said external conductive structure comprises a first conductive integration structure, a second conductive integration structure, and a third conductive integration structure;

wherein said first conductive integration structure contacts said first A conductive layer first tab and said first conductive region;

wherein said second conductive integration structure contacts said first B conductive layer first tab and said second conductive region;

wherein said third conductive integration structure contacts said first G conductive layer first tab and said third conductive region.

5. The assembly of claim 4 wherein said first conductive integration structure resides on a at least said left side surface, said second conductive integration structure resides on at least said right side surface, and said third conductive integration structure resides between said first conductive integration structure and said second conductive integration structure.

6. The assembly of claim 4 further comprising a fourth conductive integration structure that contacts said first G conductive layer second tab and said third conductive region.

7. The assembly of claim 4 wherein said third conductive integration structure also contacts said first G conductive layer second tab and said third conductive region.

8. The structure of claim 1:

wherein said first G conductive layer main body portion extends in a region near said upper side surface;

wherein said first A conductive layer main body portion extends, in a region closer to said lower side surface than said upper side surface, from said first A conductive layer first tab towards said left side surface, such that a portion of said first G conductive layer main body portion is between a portion of said first A conductive layer main body portion and said upper side surface; and

wherein said first B conductive layer main body portion extends, in a region closer to said lower side surface than said upper side surface, from said first B conductive layer first tab towards said right side surface, such that a portion of said first G conductive layer main body portion is between a portion of said first B conductive layer main body portion and said upper side surface.

9. The structure of claim 8:

wherein said first G conductive layer first tab extends to said upper side surface;

wherein said a first G conductive layer main body portion extends, in a region closer to said upper side surface than said lower side surface, further towards said left side surface than said first G conductive layer first tab; and

wherein said a first G conductive layer main body portion extends, in a region closer to said upper side surface than said lower side surface, further towards said right side surface than said first G conductive layer first tab.

10. The structure of claim 1 wherein said first A conductive layer first tab extends to at least one of said left side surface, said upper side surface, and said bottom side surface.

11. The structure of claim 1 wherein said first A conductive layer first tab extends to all of said lea side surface, a portion of said upper side surface at the intersection of said upper side surface and said left side surface, and a portion of said lower side surface at the intersection of said lower side surface and said left side surface.

12. The structure of claim 1 wherein said first A conductive layer first tab extends to only said left side surface.

13. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of said first A conductive layer first tab and a first A conductive layer second tab;

wherein said first A conductive layer first tab extends to only said upper side surface; and

wherein said first A conductive layer second tab extends only to said lower side surface.

14. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of said first A conductive layer first tab and a first A conductive layer second tab;

wherein said first A conductive layer first tab extends to only said upper side surface; and

wherein said first A conductive layer second tab extends only to a region at a corner of said lower side surface and said left side surface.

15. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of said first A conductive layer first tab, a first A conductive layer second tab, and a first A conductive layer third tab;

wherein said first A conductive layer first tab extends to only said upper side surface;

wherein said first A conductive layer second tab extends only to said left side surface; and

wherein said first A conductive layer third tab extends only to said lower side surface.

16. The structure of claim 1 wherein said A conductive layer and said B conductive layer are mirror images of one another about a line extending from a center of said upper side surface to a center of said lower side surface.

17. The structure of claim 1:

wherein said first A conductive layer first tab extends to a region at a corner of said lower side surface and said left side surface;

wherein said first B conductive layer first tab extends to a region at a corner of said upper side surface and said right side surface;

wherein said first G conductive layer first tab extends to a region at a corner of said upper side surface and said left side surface; and

wherein said first G conductive layer second tab extends to a region at a corner of said lower side surface and said right side surface.

18. The structure of claim 1 wherein said G conductor main body portion has a G conductor main body portion area, said A conductor main body portion has an A conductor main body portion area, and said G conductor main body portion area is larger than said A conductor main body portion area.

19. The structure of claim 1 further comprising a second G conductive layer in a second plane;

wherein said second G conductive layer comprises at least a second G conductive layer first tab, a second G conductive layer second tab, and a second G conductive main body portion; and

wherein said first G conductive layer and said second G conductive layer are stacked such that (1) said first G conductive layer first tab and said second G conductive layer first tab overlap and (2) said first G conductive layer second tab and said second G conductive layer second tab overlap.

20. The structure of claim 19 wherein said second G conductive layer includes no tabs other than said second G conductive layer first tab and said second G conductive layer second tab, and wherein said second G conductive layer occupies a majority of the area between said left side, said right side surface, said upper side surface, and said lower side surface.

21. The structure of claim 1:

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer form a first pattern;

further comprising a second A conductive layer, a second B conductive layer, and a second G conductive layer that form a second pattern in a second plane.

22. The structure of claim 21 wherein said second pattern is different from said first pattern.

23. An method of making an internal structure of an energy conditioner comprising:

providing said internal structure comprising a dielectric material and a conductive material;

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer, a first B conductive layer, and a first G conductive layer in a first plane;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab and a first A conductive layer main body portion;

wherein said first B conductive comprises at least one first B conductive layer first tab and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive layer first tab, a first G conductive layer second tab, and a first G conductive layer main body portion;

wherein said first A conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first B conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first G conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface; and

wherein said first G conductive layer is between said A conductive layer and said B conductive layer.

24. A method of using an internal structure of an energy conditioner:

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein said internal structure comprises a dielectric material and a conductive material;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer, a first B conductive layer, and a first G conductive layer in a first plane;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab and a first A conductive layer main body portion;

wherein said first B conductive comprises at least one first B conductive layer first tab and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive layer first tab, a first G conductive layer second tab, and a first G conductive layer main body portion;

wherein said first A conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first B conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first G conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first G conductive layer is between said A conductive layer and said B conductive layer; and

said method comprising conditioning electrical energy in a circuit including said internal structure.

25. An energy conditioner comprising:

internal structure; and

an external structure;

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein said internal structure comprises a dielectric material and a conductive material;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer and a first B conductive layer in a first plane, and a first G conductive layer in a second plane, said second plane above said first plane;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab, a first A conductive layer second tab, and a first A conductive layer main body portion;

wherein said first B conductive comprises at least one first B conductive layer first tab, a first B conductive layer second tab, and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive layer first tab, a first G conductive layer second tab, and a first G conductive layer main body portion;

wherein said first A conductive layer first tab extends to said upper side surface near said left side surface;

wherein said first A conductive layer second tab extends to said lower side surface near said left side surface;

wherein said first A conductive layer main body portion extends in a region closer to said right side surface than said left side surface and closer to said upper side surface than said lower side surface;

wherein said first B conductive layer first tab extends to said upper side surface near said right side surface;

wherein said first B conductive layer second tab extends to said lower side surface near said right side surface;

wherein said first B conductive layer main body portion extends in a region closer to said left side surface than said right side surface and closer to said lower side surface than said upper side surface;

said external structure comprises a first conductive integration structure, a second conductive integration structure, a third conductive integration structure, and a fourth conductive integration structure;

wherein first conductive integration structure contacts to said first A conductive layer first tab and said first A conductive layer second tab;

wherein second conductive integration structure contacts to said first B conductive layer first tab and said first B conductive layer second tab;

wherein third conductive integration structure contacts to said first G conductive layer first tab; and

wherein fourth conductive integration structure contacts to said first G conductive layer second tab.

26. The conditioner of claim 25 wherein said third conductive integration structure and said fourth conductive integration structure form a band on the outer surface of said energy conditioner.

27. The conditioner of claim 25 wherein said first G conductive layer first tab extends to said lower side surface and said first G conductive layer second tab extends to said upper side surface.

28. The conditioner of claim 25 wherein said first G conductive layer first tab extends to said left side surface and said first G conductive layer second tab extends to said right side surface.

29. The conditioner of claim 25:

wherein said conductive material comprises a second A conductive layer and a second B conductive layer in a third plane, said third plane above said first plane;

wherein said second A conductive layer comprises a second A conductive layer first tab and a second A conductive layer second tab; and

wherein said second B conductive layer comprises a second B conductive layer first tab and a second B conductive layer second tab.

30. The conditioner of claim 29:

wherein said second A conductive layer first tab overlaps with said first A conductive layer first tab; and

wherein said second B conductive layer first tab overlaps with said first B conductive layer first tab.

31. The conditioner of claim 30:

wherein said second B conductive layer comprises a second B conductive layer main body portion;

wherein said second A conductive layer comprises a second A conductive layer main body portion;

wherein said first A conductive layer main body portion is aligned with said second A conductive layer main body portion; and

wherein said first B conductive layer main body portion is aligned with said second B conductive layer main body portion.

32. The conditioner of claim 30:

wherein said second B conductive layer comprises a second B conductive layer main body portion;

wherein said second A conductive layer comprises a second A conductive layer main body portion;

wherein said first A conductive layer main body portion substantially overlaps with said second B conductive layer main body portion; and

wherein said first B conductive layer main body portion substantially overlaps with said second B conductive layer main body portion.

33. The conditioner of claim 25 wherein said external structure comprises no more than four conductive integration structures.

34. A method of making an energy conditioner comprising:

providing an internal structure; and

providing an external structure;

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein said internal structure comprises a dielectric material and a conductive material;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer and a first B conductive layer in a first plane, and a first G conductive layer in a second plane, said second plane above said first plane;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab, a first A conductive layer second tab, and a first A conductive layer main body portion;

wherein said first B conductive comprises at least one first B conductive layer first tab, a first A conductive layer second tab, and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive layer first tab, a first G conductive layer second tab, and a first G conductive layer main body portion;

wherein said first A conductive layer first tab extends to said upper side surface near said left side surface;

wherein said first A conductive layer second tab extends to said lower side surface near said left side surface;

wherein said first A conductive layer main body portion extends in a region closer to said right side surface than said left side surface and closer to said upper side surface than said lower side surface;

wherein said first B conductive layer first tab extends to said upper side surface near said right side surface;

wherein said first B conductive layer second tab extends to said lower side surface near said right side surface;

wherein said first B conductive layer main body portion extends in a region closer to said left side surface than said right side surface and closer to said lower side surface than said upper side surface;

said external structure comprises a first conductive integration structure, a second conductive integration structure, a third conductive integration structure, and a fourth conductive integration structure;

wherein first conductive integration structure contacts to said first A conductive layer first tab and said first A conductive layer second tab;

wherein second conductive integration structure contacts to said first B conductive layer first tab and said first B conductive layer second tab;

wherein third conductive integration structure contacts to said first G conductive layer first tab; and

wherein fourth conductive integration structure contacts to said first G conductive layer second tab.

35. A method of using an energy conditioner, said energy conditioner comprising:

internal structure; and

an external structure;

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein said internal structure comprises a dielectric material and a conductive material;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer and a first B conductive layer in a first plane, and a first G conductive layer in a second plane, said second plane above said first plane;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab, a first A conductive layer second tab, and a first A conductive layer main body portion;

wherein said first B conductive comprises at least one first B conductive layer first tab, a first A conductive layer second tab, and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive layer first tab, a first G conductive layer second tab, and a first G conductive layer main body portion;

wherein said first A conductive layer first tab extends to said upper side surface near said left side surface;

wherein said first A conductive layer second tab extends to said lower side surface near said left side surface;

wherein said first A conductive layer main body portion extends in a region closer to said right side surface than said left side surface and closer to said upper side surface than said lower side surface;

wherein said first B conductive layer first tab extends to said upper side surface near said right side surface;

wherein said first B conductive layer second tab extends to said lower side surface near said right side surface;

wherein said first B conductive layer main body portion extends in a region closer to said left side surface than said right side surface and closer to said lower side surface than said upper side surface;

said external structure comprises a first conductive integration structure, a second conductive integration structure, a third conductive integration structure, and a fourth conductive integration structure;

wherein first conductive integration structure contacts to said first A conductive layer first tab and said first A conductive layer second tab;

wherein second conductive integration structure contacts to said first B conductive layer first tab and said first B conductive layer second tab;

wherein third conductive integration structure contacts to said first G conductive layer first tab;

wherein fourth conductive integration structure contacts to said first G conductive layer second tab; and

said method comprising conditioner electrical energy in a circuit containing said energy conditioner.