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Wafer bonding method

  • US 7,632,738 B2
  • Filed: 12/29/2008
  • Issued: 12/15/2009
  • Est. Priority Date: 06/24/2003
  • Status: Expired due to Fees
First Claim
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1. A method, comprising:

  • providing an interconnect region;

    providing a substrate which includes a stack of semiconductor material layers;

    forming a bonding interface between the interconnect region and substrate using a conductive bonding region; and

    processing the substrate to form a mesa structure.

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