Sealed light emitting diode assemblies including annular gaskets and methods of making same
DC CAFCFirst Claim
1. A method comprising:
- disposing an optoelectronic device on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board;
disposing an annular gasket on the circuit board to surround the optoelectronic device; and
sealing the circuit board with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device, the sealing comprising (i) disposing the circuit board in an injection mold that includes a generally hollow member receiving the optoelectronic device and having an edge sealing against the gasket and (ii) injecting sealant material into the injection mold, the injected sealant material being blocked by the generally hollow member and the annular gasket from reaching the optoelectronic device.
1 Assignment
Litigations
0 Petitions
Accused Products
Abstract
An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.
29 Citations
13 Claims
-
1. A method comprising:
-
disposing an optoelectronic device on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board; disposing an annular gasket on the circuit board to surround the optoelectronic device; and sealing the circuit board with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device, the sealing comprising (i) disposing the circuit board in an injection mold that includes a generally hollow member receiving the optoelectronic device and having an edge sealing against the gasket and (ii) injecting sealant material into the injection mold, the injected sealant material being blocked by the generally hollow member and the annular gasket from reaching the optoelectronic device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
Specification