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Sealed light emitting diode assemblies including annular gaskets and methods of making same

DC CAFC
  • US 7,633,055 B2
  • Filed: 03/08/2007
  • Issued: 12/15/2009
  • Est. Priority Date: 03/08/2007
  • Status: Expired due to Fees
First Claim
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1. A method comprising:

  • disposing an optoelectronic device on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board;

    disposing an annular gasket on the circuit board to surround the optoelectronic device; and

    sealing the circuit board with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device, the sealing comprising (i) disposing the circuit board in an injection mold that includes a generally hollow member receiving the optoelectronic device and having an edge sealing against the gasket and (ii) injecting sealant material into the injection mold, the injected sealant material being blocked by the generally hollow member and the annular gasket from reaching the optoelectronic device.

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