Semiconductor device with antenna and separating layer
First Claim
1. A semiconductor device comprising:
- a support base interposed between a pair of first adhesives;
a thin film integrated circuit, an antenna, and a separating layer over the pair of first adhesives;
a wiring electrically connecting the thin film integrated circuit and the antenna;
a second adhesive over the wiring; and
a cover material over the second adhesive,wherein the wiring passes through the separating layer, andwherein the pair of first adhesives has a higher adhesion than the separating layer.
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Accused Products
Abstract
The invention provides a semiconductor device which can reliably restrict transmission/reception of signals or a power source voltage between a reader/writer when peeled off after stuck to an object. The semiconductor device of the invention includes an integrated circuit and an antenna formed on a support base. In the semiconductor device of the invention, a separating layer which is overlapped with the integrated circuit and the antenna sandwiching an insulating film is formed on the support base. A wiring for electrically connecting the integrated circuit and the antenna, a wiring for electrically connecting semiconductor elements in an integrated circuit, or a wiring which forms the antenna passes through the separating layer.
11 Citations
15 Claims
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1. A semiconductor device comprising:
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a support base interposed between a pair of first adhesives; a thin film integrated circuit, an antenna, and a separating layer over the pair of first adhesives; a wiring electrically connecting the thin film integrated circuit and the antenna; a second adhesive over the wiring; and a cover material over the second adhesive, wherein the wiring passes through the separating layer, and wherein the pair of first adhesives has a higher adhesion than the separating layer. - View Dependent Claims (4, 7, 12, 13, 14, 15)
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2. A semiconductor device comprising:
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a support base interposed between a pair of first adhesives; a thin film integrated circuit, a separating layer, and an antenna sequentially laminated over the pair of first adhesives; a wiring electrically connecting the thin film integrated circuit and the antenna; a second adhesive over the wiring; and a cover material over the second adhesive, wherein the wiring passes through the separating layer, and wherein the pair of first adhesives has a higher adhesion than the separating layer.
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3. A semiconductor device comprising:
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a support base interposed between a pair of first adhesives; a thin film integrated circuit, an antenna, and a separating layer over the pair of first adhesives, wherein the thin film integrated circuit comprises a plurality of semiconductor elements; a wiring electrically connecting the plurality of semiconductor elements; a second adhesive over the wiring; and a cover material over the second adhesive, wherein the wiring passes through the separating layer, and wherein the pair of first adhesives has a higher adhesion than the separating layer. - View Dependent Claims (5, 6)
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8. A semiconductor device comprising:
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a support base interposed between a pair of first adhesives; a thin film integrated circuit, an antenna, and a separating layer over the pair of first adhesives; a second adhesive over the antenna; and a cover material over the second adhesive, wherein the antenna comprises a plurality of wirings connected in series, and wherein at least one of the plurality of wirings passes through the separating layer, and wherein the pair of first adhesives has a higher adhesion than the separating layer. - View Dependent Claims (9)
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10. A semiconductor device comprising:
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a support base interposed between a pair of first adhesives; a thin film integrated circuit, an antenna, and a separating layer sequentially laminated over the pair of first adhesives; a second adhesive over the antenna; and a cover material over the second adhesive, wherein the antenna comprises a plurality of wirings connected in series, wherein at least one of the plurality of wirings passes through the separating layer, and wherein the pair of first adhesives has a higher adhesion than the separating layer. - View Dependent Claims (11)
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Specification