Light emitting assembly and backlight device employing the same

• US 7,635,204 B2
• Filed: 03/16/2006
• Issued: 12/22/2009
• Est. Priority Date: 04/06/2005
• Status: Expired due to Fees

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Yu, Tai-Cherng
• Primary Examiner(s): O'Shea; Sandra L
• Assistant Examiner(s): APENTENG, JESSICA MCMILLAN
• Application Number:
  US11/308,333
• Publication Number:
  US 20060227554A1
• Time in Patent Office: 1,377 Days
• Field of Search: 362/252, 362/231, 362/294, 362/97, 362/555, 362/612, 362/609, 362/631, 362/623
• US Class Current: 362/294
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A light emitting assembly (50) includes a metal circuit board (54) having a first surface and an opposite second surface, a light emitting module (52) mounted on the first surface of the metal circuit board, and a cooling module (58) attached to the second surface of the metal circuit board. A backlight device (90) includes a reflection plate (91), a diffuser sheet (93) disposed on the reflection plate and a plurality of light emitting assemblies (92) regularly arranged between the reflection plate and the diffuser sheet. Each light emitting assembly includes a metal circuit board (922) having a first surface and an opposite surface, a light emitting module (921) mounted on the first surface of the metal circuit board and a cooling module (923) attached to the second surface of the metal circuit board. The present light emitting assembly and backlight device can increase heat abstraction efficiency.

Claims

1. A light emitting assembly, comprising:

a metal circuit board having a first surface and an opposite second surface;

a light emitting module mounted on the first surface of the metal circuit board, P the light emitting module comprising a plurality of light emitting diodes each having a positive electrode and a negative electrode, the positive electrode of each light emitting diode being connected to the negative electrode of a neighboring light emitting diode, the negative electrode of the light emitting diode being connected to the positive electrode of the neighboring light emitting diode, the positive electrodes and the negative electrodes of the plurality of light emitting diodes being respectively formed on two opposite sides of the light emitting module, wherein the plurality of light emitting diodes comprising at least one red light emitting diode, at least one green light emitting diode and at least one blue light emitting diode such that mixed light emitted therefrom appears to be white light; and

a cooling module attached to the second surface of the metal circuit board.

2. The light emitting assembly as claimed in claim 1, wherein the cooling module comprises a heat dissipation device having a number of cooling fins.

3. The light emitting assembly as claimed in claim 2, wherein the cooling fins are comprised of a heat conductive material.

4. The light emitting assembly as claimed in claim 3, wherein the heat conductive material is selected from the group consisting of copper, aluminum and a combination alloy thereof.

5. The light emitting assembly as claimed in claim 1, wherein the cooling module further comprises one of a water cooling device or at least a heat pipe.

6. The light emitting assembly as claimed in claim 1, wherein the metal circuit board is comprised of a heat conductive material.

7. The light emitting assembly as claimed in claim 6, wherein the heat conductive material is selected from the group consisting of copper, aluminum, and a combination alloy thereof.

8. The light emitting assembly as claimed in claim 1, wherein the plurality of light emitting diodes is configured in a line in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode.

9. The light emitting assembly as claimed in claim 1, wherein the plurality of light emitting diodes is arranged in one of curves and circles in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode.

10. A backlight device, comprising:

a reflection plate;

a diffuser sheet disposed on the reflection plate; and

a plurality of light emitting assemblies regularly arranged between the reflection plate and the diffuser sheet, each light emitting assembly comprising a metal circuit board having a first surface and an opposite second surface, a light emitting module mounted on the first surface of the metal circuit board, the light emitting module comprising a plurality of light emitting diodes each having a positive electrode and a negative electrode, the positive electrode of each light emitting diode being connected to the negative electrode of a neighboring light emitting diode, the negative electrode of the light emitting diode being connected to the positive electrode of the neighboring light emitting diode, the positive electrodes and the negative electrodes of the plurality of light emitting diodes being respectively formed on two opposite sides of the light emitting modules wherein the plurality of light emitting diodes comprising at least one red light emitting diode, at least one green light emitting diode and at least one blue light emitting diode such that mixed light emitted therefrom appears to be white light; and

a cooling module attached to the second surface of the metal circuit board.

11. The backlight device as claimed in claim 10, wherein the cooling system comprises a heating dissipation device having a number of cooling fins.

12. The backlight device as claimed in claim 11, wherein the cooling fins and the metal circuit board are comprised of a heat conductive material.

13. The backlight device as claimed in claim 12, wherein the heat conductive material is selected from the group consisting of copper, aluminum and a combination alloy thereof.

14. The backlight device as claimed in claim 10, wherein the plurality of light emitting diodes is configured in a line in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode.

15. The light emitting modules as claimed in claim 10, wherein the plurality of light emitting diodes is arranged in one of a curve and a circle in an order selected from the group consisting of G-R-B-R-G, R-G-B-G-R, G-R-B-B-R-G, R-G-B-B-G-R, G-R-B-G-G-B-R-G, G-R-B-B-R-G-G-R-B, wherein, R represents a red light emitting diode, G represents a green light emitting diode, and B represents a blue light emitting diode.