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Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate

  • US 7,635,418 B2
  • Filed: 12/03/2004
  • Issued: 12/22/2009
  • Est. Priority Date: 12/03/2004
  • Status: Active Grant
First Claim
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1. A shielding assembly for holding a first substrate during treatment with a plasma, the first substrate having a first side, a plurality of features projecting from the first side, a second side opposite to the first side, and an extraneous material on the second side, said shielding assembly comprising:

  • a first mask including a plurality of concavities each positioned and dimensioned to receive a respective one of plurality of features projecting from the first side of the first substrate, and said first mask defining a seal with the first substrate about each of said plurality of concavities to prevent the ingress of the plasma into said plurality of concavities;

    an upper frame including a plurality of windows for passing the plasma into contact with the extraneous material on the second side of the first substrate to remove the extraneous material, each of said windows including a first side edge, a second side edge, and a plurality of cross members extending between said first and second side edges, and said cross members positioned such that the second side of the first substrate is at least partially exposed; and

    a lower plate including an annular rim projecting toward said upper frame and a recess defined below a plane containing said rim, and said recess configured to receive said first mask so that said first mask is located between said upper frame and said lower plate.

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