Apparatus and methods for packaging electronic devices for optical testing

• US 7,635,904 B2
• Filed: 03/21/2005
• Issued: 12/22/2009
• Est. Priority Date: 03/21/2005
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Stellari, Franco, Song, Peilin, Tosi, Alberto
• Primary Examiner(s): ANDUJAR, LEONARDO
• Application Number:
  US11/085,734
• Publication Number:
  US 20060208753A1
• Time in Patent Office: 1,737 Days
• Field of Search: 257431-466, 257600-699
• US Class Current: 257/432
• CPC Class Codes: G01R 1/0408 Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

Claims

1. An apparatus for packaging electronic devices, comprising:

a mounting plate having a first surface and a second surface;

an IC (integrated circuit) chip having a front surface and a back surface, wherein the back surface of the chip is mounted to the first surface of the mounting plate;

a package body, wherein the mounting plate is attached to the package body;

wherein at least a portion of the mounting plate adjacent the back surface of the IC chip is transparent to one or more wavelengths of light to allow photons to pass through the mounting plate between the first and second surfaces;

wherein the package body comprises a first surface, a second surface and an aperture formed between the first and second surfaces of the package body, and wherein the mounting plate is attached to the first surface of the package body such that the IC chip is aligned and inserted into the aperture; and

one or more off-chip electrical components mounted on the first surface, second surface or first and second surfaces of the package body.

2. The apparatus of claim 1, wherein said portion of the mounting plate is transparent to photons emitted from the IC chip.

3. The apparatus of claim 1, wherein said portion of the mounting plate is transparent to photons emitted by a laser that is used to irradiate the IC chip.

4. The apparatus of claim 1, wherein the package body further comprises wires and connectors to provide an electrical interface to the IC chip.

5. The apparatus of claim 1, further comprising wire bonds connected to bond pads on the front surface of the IC chip and to wires or bond pads formed on the second surface of the package body.

6. The apparatus of claim 1, wherein the package body is formed using a printed circuit board.

7. The apparatus of claim 1, further comprising an index matching material disposed between the mounting plate and the back surface of the IC chip.

8. The apparatus of claim 7, wherein the index matching material comprises bond material that is used to bond the back surface of the IC chip to the mounting plate.

9. The apparatus of claim 1, wherein the mounting plate comprises a material that is doped with another material to match an index of refraction of the mounting plate to an index of refraction of substrate material of the IC chip.

10. The apparatus of claim 1, wherein the mounting plate is formed of silicon.

11. The apparatus of claim 1, wherein the mounting plate is formed of glass.

12. The apparatus of claim 1, wherein the mounting plate is formed of quartz.

13. The apparatus of claim 1, wherein the mounting plate is formed of diamond.

14. An apparatus for packaging electronic devices, comprising:

a mounting plate having a first surface and a second surface;

an IC (integrated circuit) chip having a front surface and a back surface, wherein the back surface of the chip is mounted to the first surface of the mounting plate; and

a package body, wherein the mounting plate is attached to the package body,

wherein at least a portion of the mounting plate adjacent the back surface of the IC chip is transparent to one or more wavelengths of light to allow photons to pass through the mounting plate between the first and second surfaces,

wherein the package body comprises a first surface, a second surface and an aperture formed between the first and second surfaces of the package body,

wherein the mounting plate is attached to the first surface of the package body such that the IC chip is aligned and inserted into the aperture, and

wherein the mounting plate comprises a material that is doped with another material to match an index of refraction of the mounting plate to an index of refraction of substrate material of the IC chip.

15. The apparatus of claim 14 wherein the package body further comprises wires and connectors to provide an electrical interface to the IC chip.

16. The apparatus of claim 14, further comprising wire bonds connected to bond pads on the front surface of the IC chip and to wires or bond pads formed on the second surface of the package body.

17. The apparatus of claim 14, further comprising one or more off-chip electrical components mounted on the first surface, second surface or first and second surfaces of the package body.

18. The apparatus of claim 14, wherein the package body is formed using a printed circuit board.

19. The apparatus of claim 14, further comprising an index matching material disposed between the mounting plate and the back surface of the IC chip.

20. The apparatus of claim 14, wherein the index matching material comprises bond material that is used to bond the back surface of the IC chip to the mounting plate.

21. An apparatus for packaging electronic devices, comprising:

a mounting plate having a first surface and a second surface;

an IC (integrated circuit) chip having a front surface and a back surface, wherein the back surface of the chip is mounted to the first surface of the mounting plate;

a package body, wherein the mounting plate is attached to the package body;

wherein at least a portion of the mounting plate adjacent the back surface of the IC chip is transparent to one or more wavelengths of light to allow photons to pass through the mounting plate between the first and second surfaces;

wherein the package body comprises a first surface, a second surface and an aperture formed between the first and second surfaces of the package body, and wherein the mounting plate is attached to the first surface of the package body such that the IC chip is aligned and inserted into the aperture; and

an index matching material disposed between the mounting plate and the back surface of the IC chip.

22. The apparatus of claim 21, wherein the index matching material comprises bond material that is used to bond the back surface of the IC chip to the mounting plate.

23. The apparatus of claim 21 wherein the package body further comprises wires and connectors to provide an electrical interface to the IC chip.

24. The apparatus of claim 21, further comprising wire bonds connected to bond pads on the front surface of the IC chip and to wires or bond pads formed on the second surface of the package body.

25. The apparatus of claim 21, further comprising one or more off-chip electrical components mounted on the first surface, second surface or first and second surfaces of the package body.

26. The apparatus of claim 21, wherein the package body is formed using a printed circuit board.