Ink jet nozzle arrangement with a segmented actuator nozzle chamber cover

• US 7,637,594 B2
• Filed: 09/25/2006
• Issued: 12/29/2009
• Est. Priority Date: 06/09/1998
• Status: Expired due to Fees

• Current Assignee: Zamtec Limited (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, McAvoy, Gregory John
• Primary Examiner(s): Do; An H
• Application Number:
  US11/525,861
• Publication Number:
  US 20070013743A1
• Time in Patent Office: 1,191 Days
• Field of Search: 347 54- 56, 347/65
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 Electromagnetic transducer
• CPC Class Codes: B41J 2002/14346 Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14435 Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2002/14475 characterised by nozzle shapes or number of orifices per chamber
• CPC Class Codes: B41J 2202/15 Moving nozzle or nozzle plate
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49401 : Fluid pattern dispersing device making, e.g., ink jet

Abstract

A nozzle arrangement includes a wafer defining a nozzle chamber which can be supplied with ink via an ink supply channel. A cover is provided which covers the nozzle chamber. The cover defines a plurality of radially extending bridging portions which terminate in a common rim through which ink in the chamber can be ejected. The cover further defines a plurality of thermal bend actuators which each extend between a respective pair of adjacent bridging portions and each terminate in a free end proximal to the rim. Each thermal bend actuator is configured to bend upon actuation so that its free end enters the nozzle chamber and ejects ink through the rim.

Claims

1. A nozzle arrangement for ejecting ink, the nozzle arrangement comprising:

a wafer defining a nozzle chamber which can be supplied with ink via an ink supply channel also defined by the wafer, the wafer incorporating drive circuitry; and

a cover which is operatively fast with the wafer and covers the nozzle chamber, the cover defining a plurality of radially extending bridging portions which terminate in a common rim through which ink in the chamber can be ejected, the cover further defining a plurality of thermal bend actuators which each extend between a respective pair of adjacent bridging portions and terminate in a free end proximal to the rim, each thermal bend actuator being connected to the drive circuitry and being configured to bend upon actuation by the drive circuitry so that its free end enters the nozzle chamber resulting in the ejection of ink through the rim.

2. A nozzle arrangement as claimed in claim 1, wherein each actuator comprises a polytetrafluoroethylene (PTFE) layer and an internal serpentine copper core in the form of a heater element connected to the drive circuitry, the copper core being positioned so that upon receipt of a signal, the PTFE layer undergoes differential thermal expansion to cause the bending of the actuator.

3. A nozzle arrangement as claimed in claim 2, wherein each copper core is located distal to each corresponding free end.

4. A nozzle arrangement as claimed in claim 2, wherein each free end is generally has a segmented annulus shape which tapers inwardly toward the rim.

5. A nozzle arrangement as claimed in claim 4, wherein each free end defines a well in which ink spatter from the rim can collect.

6. A nozzle arrangement as claimed in claim 1, wherein the cover is substantially planar when each thermal bend actuator is de-activated.

7. A nozzle arrangement as claimed in claim 1, wherein the wafer defines a funnel-like wall which tapers inwardly towards the ink supply channel.

8. A nozzle arrangement as claimed in claim 7, wherein the ink supply channel and rim are superposed with respect to each other.