Solar cell fabrication using extrusion mask

• US 7,638,438 B2
• Filed: 12/12/2006
• Issued: 12/29/2009
• Est. Priority Date: 12/12/2006
• Status: Expired due to Fees

• Current Assignee: Solarworld Innovations GmbH (Solarworld AG)
• Original Assignee: Palo Alto Research Center, Inc. (Xerox Holdings Corp.)
• Inventors: Eldershaw, Craig
• Primary Examiner(s): NGUYEN, CUONG QUANG
• Application Number:
  US11/609,787
• Publication Number:
  US 20080138999A1
• Time in Patent Office: 1,113 Days
• Field of Search: 438/462, 438758-759, 438/E21.24
• US Class Current: 438/759
• CPC Class Codes: H01L 31/022425 for solar cells
• CPC Class Codes: H01L 31/1804 comprising only elements of Group IV of the Periodic Table
• CPC Class Codes: Y02E 10/547 Monocrystalline silicon PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 438/975 Substrate or mask aligning feature

Abstract

Large-area ICs (e.g., silicon wafer-based solar cells) are produced by positioning a mask between an extrusion head and the IC wafer during extrusion of a dopant bearing material or metal gridline material. The mask includes first and second peripheral portions that are positioned over corresponding peripheral areas of the wafer, and a central opening that exposes a central active area of the wafer. The extrusion head is then moved relative to the wafer, and the extrusion material is continuously extruded through outlet orifices of the extrusion head to form elongated extruded structures on the active area of the wafer. The mask prevents deposition of the extrusion material along the peripheral edges of the wafer, and facilitates the formation of unbroken extrusion structures. The mask may be provided with a non-rectangular opening to facilitate the formation of non-rectangular (e.g., circular) two-dimensional extrusion patterns.

Claims

1. A system for fabricating an integrated circuit on a semiconductor substrate, the system comprising:

an extrusion head including a plurality of outlet orifices;

a mask having a first peripheral portion defining a first inside edge and a central opening defined by the first inside edge;

means for aligning the mask such that the first peripheral portion is positioned over one of a first peripheral area of the semiconductor substrate and a second peripheral area of the semiconductor substrate, and such that the central opening is positioned over a central area of the semiconductor substrate disposed between the first and second peripheral areas;

means for moving the extrusion head relative to the semiconductor substrate such that the plurality of outlet orifices are moved from a first position over the first peripheral area to a second position over the second peripheral area, whereby the plurality of outlet orifice pass over the central area of the semiconductor substrate;

means for controlling extrusion of a material such that said material is continuously extruded through the plurality of outlet orifices while the extrusion head is moved from the first position to the second position, whereby the extruded material forms a plurality of elongated extruded structures on the central area of the semiconductor substrate.

2. The system according to claim 1,

wherein the mask further comprises a second peripheral portion defining a second inside edge, and wherein the central opening is disposed between the first and second inside edges;

wherein said means for aligning the mask comprises means for positioning the first peripheral portion over the first peripheral area of the semiconductor substrate, and positioning the second peripheral portion over the second peripheral area of the semiconductor substrate.

3. The system of claim 1, wherein said means for controlling extrusion comprises means for initiating said extrusion when the extrusion head is in the first position, and terminating said extrusion when the extrusion head is in the second position.

4. The system of claim 1, wherein the mask comprises one of a plastic film, a metallic film and paper.

5. The system of claim 1, wherein the central opening comprises one of a rectangular opening, a round opening and an octagonal opening.

6. The system of claim 1, further comprising means for heating the plurality of elongated extruded structures such that a dopant contained in said plurality of elongated extruded structures diffuses into the semiconductor substrate, thereby forming a plurality of doped regions.

7. The system according to claim 6, further comprising:

means for depositing a passivation layer on a surface of the semiconductor substrate over the plurality of doped regions,

means for laser ablating portions of the passivation layer such that a plurality of contact openings are defined through the passivation layer to each of the plurality of doped regions,

means for depositing a conductive contact structure into each of the contact openings using a direct-write metallization apparatus, and

means for depositing metal line structures onto an upper surface of the passivation layer such that each metal line structure contacts a group of said contact structures that are disposed over a corresponding one of said doped regions.

8. The system according to claim 7, wherein said means for depositing said metal line structures comprises a second mask having a first peripheral portion positioned over a first peripheral area of the passivation layer, a second peripheral portion positioned over a second peripheral area of the passivation layer, and a central opening is positioned over the central area of the semiconductor substrate.

9. The system according to claim 1, further comprising means for depositing a passivation layer on a surface of the semiconductor substrate before extruding said material.

10. The system of claim 1, wherein the mask is attached to the semiconductor substrate.

11. The system of claim 1,

wherein the semiconductor substrate is mounted on a carrier, and

wherein the mask is attached to the carrier over the semiconductor substrate.

12. The system of claim 1, wherein the mask is suspended between the carrier and the extrusion head.

13. The system of claim 1,

wherein the mask is mounted on a belt having a first portion wound around a first spool and a second portion wound around a second spool, and

wherein said means for aligning the mask comprises means for rotating the first and second spools such that the central opening of the mask is positioned over the central area of the semiconductor substrate.

14. The system of claim 13, wherein the belt comprises alternating large and small mask openings.

15. The system of claim 13, wherein each of said extrusion head and said first and second spools are mounted to a gantry.

16. The system of claim 13, wherein the belt comprises a plurality of optically readable index markers.

17. The system of claim 13, wherein said means for rotating the first and second spools comprises one of an electrical connection, a pneumatic connection, and a mechanical mechanism.