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Power semiconductor devices and methods of manufacture

  • US 7,638,841 B2
  • Filed: 05/31/2006
  • Issued: 12/29/2009
  • Est. Priority Date: 05/20/2003
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a drift region of a first conductivity type;

    a well region extending above the drift region and having a second conductivity type opposite the first conductivity type;

    an active trench extending through the well region and into the drift region, the active trench having its sidewalls and bottom lined with dielectric material, and the active trench being substantially filled with a first conductive layer, a second conductive layer and a first gate conductive layer, the first conductive layer being disposed below the first gate conductive layer and separated from the gate electrode by an inter-electrode dielectric material, the second conductive layer being disposed below the first conductive layer and separated from the first conductive layer by the inter-electrode dielectric material;

    source regions having the first conductivity type formed in the well region adjacent the active trench; and

    a first Schottky structure formed on a first mesa between two adjacent trenches;

    wherein the two adjacent trenches, between which the first Schottky structure is formed, are substantially filled with the first conductive layer, the second conductive layer and the first gate conductive layer.

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