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Wired circuit board

  • US 7,638,873 B2
  • Filed: 11/30/2006
  • Issued: 12/29/2009
  • Est. Priority Date: 12/01/2005
  • Status: Active Grant
First Claim
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1. A wired circuit board comprising:

  • a metal supporting board;

    a first metal thin film formed on the metal supporting board;

    a metal foil formed on the first metal thin film;

    a second metal thin film formed on the metal foil;

    an insulating layer formed on the second metal thin film; and

    a conductive pattern formed on the insulating layer.

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