Electronic module design to maximize volume efficiency
First Claim
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1. An electronic module, comprising:
- an integrated circuit having a top face with a plurality of first interconnect pads;
at least one redistribution layer adjacent to the top face of the integrated circuit, wherein the redistribution layer is electrically connected to the first interconnect pads and includes at least one conductive trace, at least one mounting pad, and a plurality of second interconnect pads, which second interconnect pads are positioned along at least one edge of the redistribution layer by the conductive traces;
at least one secondary component mounted to the at least one mounting pad and electrically connected to the integrated circuit via the redistribution layer;
a substrate including electrical traces terminating along at least one edge of the substrate; and
wire bonds connecting at least one of the second interconnect pads along at least one edge of the redistribution layer and at least one of the electrical traces along at least one edge of the substrate.
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Abstract
Compact electronic modules, which may be used with implantable microstimulators and other medical and non-medical devices, and manufacture/assembly of such modules are described. Component and circuitry designs utilize unique redistribution techniques and attachment methods. A number of component designs and packaging configurations maximize the volume efficiency of electronic modules. Also included are improved processes and systems enabling the manufacture and assembly of such compact packages.
49 Citations
22 Claims
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1. An electronic module, comprising:
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an integrated circuit having a top face with a plurality of first interconnect pads; at least one redistribution layer adjacent to the top face of the integrated circuit, wherein the redistribution layer is electrically connected to the first interconnect pads and includes at least one conductive trace, at least one mounting pad, and a plurality of second interconnect pads, which second interconnect pads are positioned along at least one edge of the redistribution layer by the conductive traces; at least one secondary component mounted to the at least one mounting pad and electrically connected to the integrated circuit via the redistribution layer; a substrate including electrical traces terminating along at least one edge of the substrate; and wire bonds connecting at least one of the second interconnect pads along at least one edge of the redistribution layer and at least one of the electrical traces along at least one edge of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An electronic module, comprising:
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a substrate including first traces; an integrated circuit having a bottom face affixed to the substrate and top face with a plurality of first interconnect pads; a redistribution layer proximate to the top face of the integrated circuit, the redistribution layer comprising second traces connected to the plurality of first interconnect pads, each second trace terminating at either a mounting pad or a second interconnect pads on a top of the redistribution layer; and at least one secondary component mounted to the at least one mounting pad and electrically connected to the integrated circuit via the redistribution layer, wherein at least one of the second interconnect pads is coupled to the first traces on the substrate. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. An electronic module, comprising:
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an integrated circuit having a top face with a plurality of first interconnect pads at least one redistribution layer adjacent to the top face of the integrated circuit, wherein the redistribution layer is electrically connected to the first interconnect pads and includes at least one conductive trace, at least one mounting pad, and a plurality of second interconnect pads, which second interconnect pads are positioned along at least one edge of the redistribution layer by the conductive traces; at least one secondary component mounted to the at least one mounting pad and electrically connected to the integrated circuit via the redistribution layer; a substrate including electrical traces terminating along at least one edge of the substrate;
wire bonds connecting at least one of the second interconnect pads along at least one edge of the redistribution layer and at least one of the electrical traces along at least one edge of the substrate;a coil comprising a winding around a core; the core comprising two separate halves; one core half secured to a portion of the redistribution layer; and a second core half secured to a portion of the substrate.
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Specification