Method for fabricating a structure for a microelectromechanical systems (MEMS) device
First Claim
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1. A method of fabricating a microelectromechanical systems (MEMS) device, the method comprising:
- forming at least one layer over a substrate, said layer comprising a sacrificial material;
patterning said sacrificial layer;
depositing an additional layer over said sacrificial layer;
patterning said additional layer using said sacrificial layer as a photomask;
forming an upper layer over the sacrificial layer; and
removing said sacrificial layer to form a MEMS cavity through which the upper layer is movable.
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Abstract
The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.
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Citations
22 Claims
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1. A method of fabricating a microelectromechanical systems (MEMS) device, the method comprising:
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forming at least one layer over a substrate, said layer comprising a sacrificial material; patterning said sacrificial layer; depositing an additional layer over said sacrificial layer; patterning said additional layer using said sacrificial layer as a photomask; forming an upper layer over the sacrificial layer; and removing said sacrificial layer to form a MEMS cavity through which the upper layer is movable. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming a microelectromechanical systems (MEMS) device, the method comprising:
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providing a light-transmissive substrate; providing a sacrificial layer over the substrate; patterning the sacrificial layer to remove at least a portion of the sacrificial layer; providing an additional layer over the sacrificial layer; patterning the additional layer by exposing the additional layer to light through the removed portion of the sacrificial layer, wherein patterning the additional layer additionally comprises blocking the light with the remaining portions of the sacrificial layer; providing an upper layer over the sacrificial layer; and removing the remainder of the sacrificial layer to form a cavity within which the upper layer is movable. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of fabricating a microelectromechanical systems (MEMS) array, the method comprising:
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forming a transparent electrode over a substrate, the substrate permitting light to pass therethrough; forming a sacrificial layer over said transparent electrode, wherein the sacrificial layer is not transmissive to light; depositing an additional layer over said sacrificial layer; patterning said additional layer by exposing the additional layer to light through the substrate; and using the patterned additional layer to produce a MEMS structure within the array. - View Dependent Claims (22)
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Specification