Method and system for sealing a substrate
First Claim
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1. A method of sealing a microelectromechanical system (“
- MEMS”
) device from ambient conditions, comprising;
providing a substrate comprising a MEMS device;
forming a metal seal on the substrate, wherein forming the metal seal comprises forming an insulator layer on the substrate, and forming a metal sealant wall on the insulator layer, wherein forming the metal seal and the metal sealant wall further comprise depositing one or more metal layers over the insulator layer; and
attaching a backplane to the metal seal so as to seal the MEMS device from ambient conditions.
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Abstract
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
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Citations
34 Claims
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1. A method of sealing a microelectromechanical system (“
- MEMS”
) device from ambient conditions, comprising;providing a substrate comprising a MEMS device; forming a metal seal on the substrate, wherein forming the metal seal comprises forming an insulator layer on the substrate, and forming a metal sealant wall on the insulator layer, wherein forming the metal seal and the metal sealant wall further comprise depositing one or more metal layers over the insulator layer; and attaching a backplane to the metal seal so as to seal the MEMS device from ambient conditions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
- MEMS”
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9. A method of making a microelectromechanical system (“
- MEMS”
) device, comprising;providing a MEMS device formed on a substrate; depositing an insulator on the substrate; depositing one or more metal layers on the insulator; forming a sealant wall proximate to a perimeter of the MEMS device and over the insulator, wherein forming a sealant wall comprises; providing a mask layer over the one or more metal layers; and patterning the mask layer to define one or more cavities; and attaching a backplane to the sealant wall. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
- MEMS”
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27. A method of sealing a microelectromechanical system (“
- MEMS”
) device from ambient conditions, comprising;providing a substrate comprising a MEMS device; forming a metal seal on the substrate, wherein forming the metal seal comprises forming an insulator layer on the substrate, and forming a metal sealant wall on the insulator layer, wherein the MEMS device comprises a sacrificial layer, and wherein the method further comprises removing the sacrificial layer from the MEMS device after forming the metal seal; and attaching a backplane to the metal seal so as to seal the MEMS device from ambient conditions. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34)
- MEMS”
Specification