MEMS packaging with improved reaction to temperature changes
First Claim
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1. A MEMS device comprising:
- a MEMS die having a rectangular shape with at least one dimension being greater than or equal to about 1.0 mm, wherein the MEMS die has a rectangular periphery;
a support structure having a top surface, a bottom surface, and a cavity formed between the top and bottom surfaces, the cavity defining a rectangular inner surface of the support structure that is at least substantially perpendicular to the top and bottom surfaces, wherein the rectangular inner surface of the support structure extends beyond the rectangular periphery of the MEMS die such tat the MEMS die is disposed on the rectangular inner surface of the support structure;
a gap that extends outward from the rectangular periphery of the MEMS die to the rectangular inner surface of the support structure;
at least one compliant mount coupled to an edge of the MEMS die and filling the entire gap, wherein the mount couples the MEMS die to the support structure; and
a pair of covers disposed on opposite sides of the support structure.
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Abstract
A large-scale MEMS device includes a MEMS die supported by at least one compliant die mount. The compliant die mount couples the MEMS die to a support structure. The support structure is positioned within a package. In accordance with an aspect of the invention, the package is substantially symmetrical about the MEMS die. In accordance with another aspect of the invention, the support structure and/or the package is designed to have a neutral bend axis along the MEMS die.
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Citations
16 Claims
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1. A MEMS device comprising:
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a MEMS die having a rectangular shape with at least one dimension being greater than or equal to about 1.0 mm, wherein the MEMS die has a rectangular periphery; a support structure having a top surface, a bottom surface, and a cavity formed between the top and bottom surfaces, the cavity defining a rectangular inner surface of the support structure that is at least substantially perpendicular to the top and bottom surfaces, wherein the rectangular inner surface of the support structure extends beyond the rectangular periphery of the MEMS die such tat the MEMS die is disposed on the rectangular inner surface of the support structure; a gap that extends outward from the rectangular periphery of the MEMS die to the rectangular inner surface of the support structure; at least one compliant mount coupled to an edge of the MEMS die and filling the entire gap, wherein the mount couples the MEMS die to the support structure; and a pair of covers disposed on opposite sides of the support structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification