Heat dissipation device and a method for manufacturing the same

• US 7,643,293 B2
• Filed: 12/18/2007
• Issued: 01/05/2010
• Est. Priority Date: 12/18/2007
• Status: Expired due to Fees

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Chu, Ching-Hung
• Primary Examiner(s): Gandhi; Jayprakash N
• Assistant Examiner(s): HOFFBERG, ROBERT JOSEPH
• Application Number:
  US11/959,289
• Publication Number:
  US 20090154105A1
• Time in Patent Office: 749 Days
• Field of Search: 36167946-67948, 361/679.52, 361/679.54, 361694-695, 361/697, 361699-700, 361702-704, 361709-710, 361/719, 165 803- 805, 165/104.33, 165/185, 174/15.2, 174/16.1, 174/16.3
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise extending downwardly and inwards from opposite edges of the top surface. A width of a bottom portion of the groove is shorter than that of a top portion of the groove. The heat pipe includes an evaporation portion directly pressed in the groove by punching and fully contacts with the groove. The evaporating portion is flattened when it is fully engaged in the groove to directly contact with an electronic component. The method involves directly pressing the evaporation portion of the heat pipe into the groove of the base.

Claims

1. A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board, the heat dissipation device comprising:

a first heat sink thermally contacting with the electronic component, the first heat sink having a base, a groove defined in the base, the groove enclosed by a top plate, two sidewalls slantwise extending downwardly and inwards from opposite edges of the top plate, whereby a width of a bottom portion of the groove is narrower than that of a top portion of the groove;

a second heat sink comprising a plurality of fins, each of the fins comprising an arched body and two legs extending downwardly from lateral ends of the body, respectively;

a fan sandwiched between the first and second heat sinks, the first heat sink supporting the fan, the legs of the fins of the second heat sink engaging with lateral sides of a top surface of the fan; and

a heat pipe comprising an evaporating portion and an condensing portion, the evaporating portion being directly pressed in the groove and fully contacting with the groove of the base of the first heat sink, wherein the evaporating portion is cylindrical before fully engaged in the groove, the evaporating portion is flattened when it is fully engaged in the groove and has a corresponding configuration of the groove, the condensing portion extending through the fins of the second heat sink.

2. The heat dissipation device as claimed in claim 1, wherein the base of the first heat sink protrudes downwardly to form a protrusion, the groove defined in the protrusion, the heat pipe having a bottom surface coplanar with a bottom surface of the protrusion of the base.

3. The heat dissipation device as claimed in claim 1, wherein the evaporation portion of the heat pipe has a top surface and a bottom surface opposite to the top surface, and a width of the top surface is larger than that of the bottom surface.

4. The heat dissipation device as claimed in claim 1, wherein the first heat sink comprises a pair of wings extends upwardly and outwardly from a top surface of the base respectively, and two elongated slots are defined at distal ends thereof respectively to mount the fan thereon.

5. The heat dissipation device as claimed in claim 4, wherein a plurality of vertical fins extends upwardly from an upper side of the wings of the first heat sink, and the vertical fins are parallel to and spaced from each other.

6. The heat dissipation device as claimed in claim 4, wherein a plurality of lateral fins extend outwardly from lateral sides of the wings of the first heat sink and parallel to and spaced from each other.

7. The heat dissipation device as claimed in claim 1, wherein the fins of the second heat sink are parallel to and spaced from each other.

8. The heat dissipation device as claimed in claim 1, wherein the heat pipe has a U-shaped configuration.

9. The heat dissipation device as claimed in claim 1 further comprising a clip spanning across the heat sink and engaging with the printed circuit board to mount the heat sink to the printed circuit board.

10. The heat dissipation device as claimed in claim 1, wherein the top plate and the sidewalls are flat.

11. The heat dissipation device as claimed in claim 1, wherein a cutout is defined at a center of an end of the first heat sink to prevent the heat pipe from interfering with the first heat sink.

12. A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board, the heat dissipation device comprising:

a first heat sink comprising a plurality of fins;

a second heat sink contacting with the electronic component and comprising a base and a plurality of fins extending from the base and spaced from each other, a groove defined in the base, a width of a bottom portion of the groove being shorter than that of a top portion, a cutout is defined at a center of an end of the second heat sink to prevent the heat pipe from interfering with the second heat sink;

a heat pipe comprising a flattened evaporating portion directly embedded in the groove of the second heat sink and a condensing portion extending through the fins of the first heat sink; and

a fan sandwiched between the first and second heat sink;

wherein each of the fins of the first heat sink comprises an arched body and two legs extending downwardly from lateral ends of the body, respectively, the second heat sink supports the fan, and the legs of the fins of the first heat sink engaging with lateral sides of a top surface of the fan.

13. The heat dissipation device as claimed in claim 12, wherein the groove is enclosed by a flat top plate, two flat sidewalls slantwise extending downwardly and inwards from opposite edges of the top plate.

14. The heat dissipation device as claimed in claim 12, wherein the fins of the first and second heat sinks are spaced from each other.