Method to form a conductive device
First Claim
1. A method to form a conductive device, said method comprising:
- providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host;
placing a metal terminal into a mold;
thereafter, exposing said metal terminal to a magnetic field; and
injecting said mold with said conductive loaded, resin-based material to complete said device wherein said magnetic field attracts and concentrates said conductive material near said metal terminal to enhance electrical conductivity between the metal terminal and the conductive loaded, resin-based material.
0 Assignments
0 Petitions
Accused Products
Abstract
Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
-
Citations
11 Claims
-
1. A method to form a conductive device, said method comprising:
-
providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host; placing a metal terminal into a mold; thereafter, exposing said metal terminal to a magnetic field; and injecting said mold with said conductive loaded, resin-based material to complete said device wherein said magnetic field attracts and concentrates said conductive material near said metal terminal to enhance electrical conductivity between the metal terminal and the conductive loaded, resin-based material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
Specification