Capped and chambered pressure sensor

• US 7,644,621 B2
• Filed: 07/29/2007
• Issued: 01/12/2010
• Est. Priority Date: 10/18/2004
• Status: Expired due to Fees

• Current Assignee: Precision Mechatronics Pty Ltd
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, Mallinson, Samuel George
• Primary Examiner(s): Caputo, Lisa M
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US11/829,944
• Publication Number:
  US 20070295096A1
• Time in Patent Office: 898 Days
• Field of Search: 73700-756, 3612831-2834
• US Class Current: 73/718
• CPC Class Codes: B60C 23/0408 transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass

Abstract

The present invention relates to a pressure sensor. The pressure sensor includes a substrate assembly. The substrate assembly defines closed channels and includes a conductive layer. A conductive membrane extends from the substrate assembly and is spaced from the conductive layer. The conductive membrane defines a plurality of apertures. A cap extends from the substrate assembly to cover the membrane.

Claims

1. A pressure sensor comprising:

a substrate assembly having a silicon substrate, a CMOS layer deposited on the silicon substrate, a conductive layer deposited on the CMOS layer; and

a protective passivation layer deposited on the conductive layer;

a conductive membrane extending from the substrate assembly and spaced from the conductive layer, the conductive membrane defining a plurality of apertures; and

a cap extending from the substrate assembly to cover the membrane.

2. A pressure sensor as claimed in claim 1, wherein the passivation layer is formed from an insulating material.

3. A pressure sensor as claimed in claim 1, wherein the passivation layer is formed from a semi-conducting material.

4. A pressure sensor as claimed in claim 1, wherein the substrate assembly has channels containing air, the conductive layer sealing the air in the channels, the CMOS layer has guard rings surrounding the channels to prevent air contained in the sealed channels from corroding circuitry.

5. A pressure sensor as claimed in claim 1, wherein the membrane has a peripheral portion which is located between the substrate assembly and the cap.

6. A pressure sensor as claimed in claim 5, wherein the cap has a peripheral portion on the peripheral portion of the membrane.