Showerhead electrode assembly for plasma processing apparatuses
First Claim
1. A showerhead electrode assembly of a semiconductor substrate processing apparatus, comprising:
- a top plate;
a showerhead electrode comprising a plate;
a backing plate including a bottom surface attached to an upper surface of the plate;
a thermal control plate including a central portion, an outer portion and a flexure portion extending from and connecting the outer portion to the central portion, the central portion being attached to a top surface of the backing plate and to the top plate such that the central portion of the thermal control plate is movable relative to the top plate, the outer portion being attached to the top plate, and the flexure portion being configured to accommodate differential thermal expansion between the top plate and the thermal control plate;
a heater on the central portion of the thermal control plate adapted to heat the thermal control plate; and
at least two laterally spaced apart thermal bridges between the central portion of the thermal control plate and the top plate, the thermal bridges providing a thermal and electrical path between the showerhead electrode and the top plate.
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Accused Products
Abstract
A showerhead electrode assembly of a plasma processing apparatus includes a thermal control plate attached to a showerhead electrode, and a top plate attached to the thermal control plate. At least one thermal bridge is provided between opposed surfaces of the thermal control plate and the top plate to allow electrical and thermal conduction between the thermal control plate and top plate. A lubricating material between the thermal bridge and the top plate minimizes galling of opposed metal surfaces due to differential thermal expansion between the top plate and thermal control plate. A heater supported by the thermal control plate cooperates with the temperature controlled top plate to maintain the showerhead electrode at a desired temperature.
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Citations
12 Claims
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1. A showerhead electrode assembly of a semiconductor substrate processing apparatus, comprising:
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a top plate; a showerhead electrode comprising a plate; a backing plate including a bottom surface attached to an upper surface of the plate; a thermal control plate including a central portion, an outer portion and a flexure portion extending from and connecting the outer portion to the central portion, the central portion being attached to a top surface of the backing plate and to the top plate such that the central portion of the thermal control plate is movable relative to the top plate, the outer portion being attached to the top plate, and the flexure portion being configured to accommodate differential thermal expansion between the top plate and the thermal control plate; a heater on the central portion of the thermal control plate adapted to heat the thermal control plate; and at least two laterally spaced apart thermal bridges between the central portion of the thermal control plate and the top plate, the thermal bridges providing a thermal and electrical path between the showerhead electrode and the top plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification