Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
First Claim
1. A method for packaging a semiconductor die, comprising:
- providing a frame structure including a plurality of frames, each frame of the plurality of frames including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout and at least one upper step extending peripherally thereabout;
securing a semiconductor die in the aperture of at least one frame of the plurality of frames with an active surface of the semiconductor die substantially abutting a surface of the at least an inverted step and a substantial portion of lateral sides thereof received within the aperture;
securing a window in the aperture of the at least one frame with a surface of the window substantially abutting a surface of the at least one upper step; and
cutting the frame structure between adjacent frames to singulate the at least one frame with the semiconductor die and the window secured therein and provide a skirt at a lower extent of the singulated at least one frame extending at least partially over a lateral side of the semiconductor die to form a semiconductor die package.
8 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.
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Citations
119 Claims
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1. A method for packaging a semiconductor die, comprising:
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providing a frame structure including a plurality of frames, each frame of the plurality of frames including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout and at least one upper step extending peripherally thereabout; securing a semiconductor die in the aperture of at least one frame of the plurality of frames with an active surface of the semiconductor die substantially abutting a surface of the at least an inverted step and a substantial portion of lateral sides thereof received within the aperture; securing a window in the aperture of the at least one frame with a surface of the window substantially abutting a surface of the at least one upper step; and cutting the frame structure between adjacent frames to singulate the at least one frame with the semiconductor die and the window secured therein and provide a skirt at a lower extent of the singulated at least one frame extending at least partially over a lateral side of the semiconductor die to form a semiconductor die package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A method for packaging a semiconductor die, comprising:
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providing a wafer bearing a plurality of semiconductor dice thereon, wherein semiconductor dice of the plurality of semiconductor dice are separated by kerfs extending downwardly into the wafer from an surface thereof along streets between the semiconductor dice of the plurality of semiconductor dice; providing a frame structure including a plurality of frames, each frame of the plurality of frames including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout and at least one upper step extending peripherally thereabout, the lower surface of the frame structure further including protrusions sized and configured to be received in the kerfs; aligning the lower surface of the frame structure with the surface of the wafer and inserting the protrusions into the kerfs until the surface of the wafer substantially abuts the inverted lower steps of the plurality of frames and the protrusions extend over lateral sides of the plurality of semiconductor dice defined by the kerfs and securing the plurality of semiconductor dice to the plurality of frames; and securing windows in at least some of the apertures with surfaces of the windows substantially abutting surfaces of the at least one upper step. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75)
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76. A method for packaging a semiconductor die, comprising:
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providing a frame structure including a plurality of frames, each frame of the plurality of frames including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having a first step extending peripherally thereabout and at least another, higher step extending peripherally thereabout and peripherally about the first step; securing a semiconductor die comprising an active surface and an opposing back side in the aperture of at least one frame of the plurality of frames with the back side of the semiconductor die substantially abutting a surface of a first step and lateral sides thereof received within the aperture; and securing a window in the aperture of the at least one frame of the plurality of frames with a surface of the window substantially abutting a surface of the at least another, higher step. - View Dependent Claims (77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113)
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114. A method for packaging a semiconductor die, comprising:
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providing a wafer bearing a plurality of semiconductor dice thereon, wherein semiconductor dice of the plurality of semiconductor dice are separated by kerfs extending downwardly into the wafer from an surface thereof along streets between the semiconductor dice of the plurality; providing a frame structure including a plurality of frames, each frame of the plurality of frames including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout, the lower surface of the frame structure further including protrusions sized and configured to be received in the kerfs; aligning the lower surface of the frame structure with the surface of the wafer and inserting the protrusions into the kerfs until the surface of the wafer substantially abuts the inverted lower steps of the plurality of frames and the protrusions extend over lateral sides of the plurality of semiconductor dice defined by the kerfs and securing the plurality of semiconductor dice to the plurality of frames; and securing a window substrate over the upper surface of the frame structure and over the apertures of the plurality of frames. - View Dependent Claims (115)
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116. A method for packaging a semiconductor die, comprising:
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forming a wafer comprising a plurality of semiconductor dice on an active surface thereof separated by kerfs extending into the wafer along streets between semiconductor dice of the plurality of semiconductor dice; forming a frame structure comprising a plurality of frames, each frame of the plurality of frames including an aperture extending therethrough between an upper surface and a lower surface of the frame structure, and at least one upper step extending peripherally about the aperture; aligning the frame structure with the active surface of the wafer and securing protrusions of the frame structure to the kerfs of the wafer, each aperture of a frame exposing a semiconductor die of the plurality of semiconductor dice; and securing windows in at least some of the apertures with surfaces of the windows substantially abutting surfaces of the at least one upper step. - View Dependent Claims (117)
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118. A method for packaging a semiconductor die, comprising:
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providing a frame structure including a plurality of frames, each frame of the plurality of frames including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having a first step extending peripherally thereabout; securing a semiconductor die comprising an active surface and an opposing back side in the aperture of at least one frame of the plurality of frames with the back side of the semiconductor die substantially abutting a surface of a first step and lateral sides thereof received within the aperture; and securing a window substrate over the upper surface of the frame structure over the aperture of the frames. - View Dependent Claims (119)
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Specification