Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer
First Claim
1. A method of depositing a metal conductive seed layer on a substrate comprising:
- a) providing a substrate having a barrier layer in a recessed feature deposited thereon to a seed layer deposition chamber;
b) performing an inert gas sputter etch of at least the sidewalls of the barrier layer in the seed layer deposition chamber;
c) depositing the metal conductive seed layer over the surface of the wafer substrate in the seed layer deposition chamber.
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Abstract
Methods of depositing thin seed layers that improve continuity of the seed layer as well as adhesion to the barrier layer are provided. According to various embodiments, the methods involve performing an etchback operation in the seed deposition chamber prior to depositing the seed layer. The etch step removes barrier layer overhang and/or oxide that has formed on the barrier layer. It some embodiments, a small deposition flux of seed atoms accompanies the sputter etch flux of argon ions, embedding metal atoms into the barrier layer. The embedded metal atoms create nucleation sites for subsequent seed layer deposition, thereby promoting continuous seed layer film growth, film stability and improved seed layer-barrier layer adhesion.
207 Citations
24 Claims
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1. A method of depositing a metal conductive seed layer on a substrate comprising:
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a) providing a substrate having a barrier layer in a recessed feature deposited thereon to a seed layer deposition chamber; b) performing an inert gas sputter etch of at least the sidewalls of the barrier layer in the seed layer deposition chamber; c) depositing the metal conductive seed layer over the surface of the wafer substrate in the seed layer deposition chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 24)
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15. A method of depositing a metal seed layer on a semiconductor substrate having recessed features;
- the method comprising;
a) providing the substrate with a barrier layer in a recessed feature deposited thereon to the seed layer deposition chamber; b) applying a DC power to a metal target within the chamber and an applied RF bias to the substrate to simultaneously etch at least the sidewalls of the barrier layer oxide and implant metal atoms into the barrier layer; c) applying a DC power to the metal target to deposit a metal seed layer that substantially coats the sidewalls of the features, wherein the implanted seeds are nucleation sites for the deposition of the metal seed layer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
- the method comprising;
Specification