Microelectronic imagers having front side contacts
First Claim
1. A microelectronic imager assembly, comprising:
- a workpiece comprising;
a substrate including a front side and a backside; and
a plurality of imaging dies formed at least partially within the substrate, the imaging dies comprising image sensors at the front side of the substrate, integrated circuitry operatively coupled to the image sensors, and bond-pads at the front side of the substrate electrically coupled to the integrated circuitry;
a plurality of stand-offs, each stand-off comprising a front side and a back side, the back side being in contact with the front side of the substrate, the stand-offs having apertures aligned with corresponding image sensors; and
a plurality of external contacts terminating at the front side of the stand-offs and electrically coupled at the front side of the substrate to corresponding bond-pads of the imaging dies.
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Accused Products
Abstract
Microelectronic imager assemblies with front side contacts and methods for fabricating such microelectronic imager assemblies are disclosed herein. In one embodiment, a microelectronic imager assembly comprises a workpiece including a substrate having a front side and a backside. The assembly further includes a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors at the front side of the substrate, integrated circuitry operatively coupled to the image sensors, and bond-pads at the front side of the substrate electrically coupled to the integrated circuitry. The assembly also includes a plurality of stand-offs at the front side of the substrate. The stand-offs have apertures aligned with corresponding image sensors. The assembly further includes a plurality of external contacts electrically coupled to corresponding bond-pads and projecting away from the dies.
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Citations
51 Claims
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1. A microelectronic imager assembly, comprising:
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a workpiece comprising; a substrate including a front side and a backside; and a plurality of imaging dies formed at least partially within the substrate, the imaging dies comprising image sensors at the front side of the substrate, integrated circuitry operatively coupled to the image sensors, and bond-pads at the front side of the substrate electrically coupled to the integrated circuitry; a plurality of stand-offs, each stand-off comprising a front side and a back side, the back side being in contact with the front side of the substrate, the stand-offs having apertures aligned with corresponding image sensors; and a plurality of external contacts terminating at the front side of the stand-offs and electrically coupled at the front side of the substrate to corresponding bond-pads of the imaging dies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A microelectronic imaging unit, comprising:
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a microelectronic die having a front side and a backside, an image sensor formed within the front side, an integrated circuit electrically coupled to the image sensor, and a plurality of bond-pads at the front side electrically coupled to the integrated circuit; a stand-off projecting from the die and having an opening aligned with the image sensor, the stand-off comprising a front side and a back side, the back side of the stand-off being in contact with the front side of the die; and a plurality of external contacts terminating at the front side of the stand-off and operatively coupled at the front side of the substrate to corresponding bond-pads of the microelectronic die. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A microelectronic imager assembly, comprising:
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a workpiece comprising; a substrate having a front side and a backside; and a plurality of imaging dies formed at least partially within the substrate, the imaging dies comprising image sensors at the front side of the substrate, integrated circuitry operatively coupled to the image sensors, and bond-pads at the front side of the substrate electrically coupled to the integrated circuitry; a plurality of stand-offs, each stand-off comprising a front side and a back side, the back side being in contact with the front side of the substrate, the stand-offs having apertures aligned with corresponding image sensors; and a plurality of interconnects terminating at the front side of the stand-offs, the interconnects extending through the stand-offs and being electrically coupled at the front side of the substrate to corresponding bond-pads of the imaging dies. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
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36. A microelectronic imager assembly, comprising:
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a workpiece comprising; a substrate including a front side and a backside; and a plurality of imaging dies formed at least partially within the substrate, the imaging dies comprising image sensors at the front side of the substrate, integrated circuitry operatively coupled to the image sensors, and bond-pads at the front side of the substrate electrically coupled to the integrated circuitry; a plurality of stand-offs, each stand-off comprising a front side and a back side, the back side being in contact with the front side of the substrate, the stand-offs having apertures aligned with corresponding image sensors; and a plurality of interconnects terminating at the front side of the stand-offs, the interconnects extending through the stand-offs and being electrically coupled at the front side of the substrate to corresponding bond-pads of the imaging dies; a plurality of covers over corresponding image sensors, the individual covers being supported by the stand-offs at corresponding dies and transmissive to a desired radiation for the image sensors; and optical devices attached to the stand-offs and/or the covers, the individual optical devices including a substrate with an optics element on and/or in the substrate at a desired location relative to one of the image sensors, wherein the optical devices include focus lenses, dispersion lenses, pin-hole lenses, filters, and/or anti-reflective films. - View Dependent Claims (37, 38, 39, 40, 41, 42)
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43. A microelectronic imager assembly, comprising:
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a workpiece comprising; a substrate including a front side and a backside; and a plurality of imaging dies formed at least partially within the substrate, the imaging dies comprising image sensors at the front side of the substrate, integrated circuitry operatively coupled to the image sensors, and bond-pads at the front side of the substrate electrically coupled to the integrated circuitry; a plurality of spacers projecting from the front side of the substrate, each spacer comprising a front side and a back side, the back side of the spacer being in contact with the front side of the substrate, and openings aligned with the image sensors; a plurality of covers over corresponding image sensors, the individual covers being supported by the spacers at a corresponding die and transmissive to a desired radiation for the image sensors; and a plurality of connectors terminating at the front side of the spacers and electrically coupled at the front side of the substrate to corresponding bond-pads of the imaging dies. - View Dependent Claims (44, 45, 46, 47, 48)
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49. A microelectronic imager, comprising:
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a microelectronic die having a front side and a backside, an image sensor formed within the front side, an integrated circuit electrically coupled to the image sensor, and a plurality of bond-pads at the front side electrically coupled to the integrated circuit; a stand-off projecting from the die and having an opening aligned with the image sensor, the stand-off comprising a front side and a back side, the back side of the stand-off being in contact with the front side of the die, and a three-dimensional stereolithography material, an epoxy, and/or a UV curable material; a plurality of interconnects extending through the stand-off and electrically coupled at the front side of the die to corresponding bond-pads of the microelectronic die, the interconnects including first end portions electrically coupled to the bond-pads and second end portions at the front side of the stand-off, spaced apart from the first end portions; a plurality of connectors electrically coupled to the second end portions of the interconnects so as to each abut the front side of the stand-off; a cover over the image sensor and attached to the stand-off, wherein the cover is transmissive to a desired radiation for the image sensor; and an optical device attached to the stand-off and/or the cover, the individual optical device including a substrate with an optics element on and/or in the substrate at a desired location relative to the image sensor, the optical devices including a focus lens, a dispersion lens, a pin-hole lens, a filter, and/or an anti-reflective film. - View Dependent Claims (50, 51)
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Specification