Thermal management of dies on a secondary side of a package
First Claim
1. An apparatus comprising:
- a first die having a first side mounted on a primary side of an electronic package, the first die having a second side coupled to a first heat spreader;
a second die mounted on a secondary side of the electronic package, between the electronic package and a first side of a printed circuit board; and
a thermal component thermally coupled to the second die and a second side of the printed circuit board, the thermal component comprising a set of pins extending from a second heat sink through a set of through-holes in the printed circuit board and thermally coupled to a surface of the second die, wherein a length of the set of pins is modifiable to accommodate height tolerances in a socket stack up between the printed circuit board and the electronic package.
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Accused Products
Abstract
An apparatus including a first die mounted on a primary side of an electronic package and a second die mounted on a secondary side of the electronic package between the electronic package and a printed circuit board. The apparatus further comprising a thermal component thermally connected to the second die and mounted on the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board. A method including positioning a set of thermal connectors through a printed circuit board, the thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side. The method further including thermally connecting the thermal connectors to a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board.
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Citations
26 Claims
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1. An apparatus comprising:
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a first die having a first side mounted on a primary side of an electronic package, the first die having a second side coupled to a first heat spreader; a second die mounted on a secondary side of the electronic package, between the electronic package and a first side of a printed circuit board; and a thermal component thermally coupled to the second die and a second side of the printed circuit board, the thermal component comprising a set of pins extending from a second heat sink through a set of through-holes in the printed circuit board and thermally coupled to a surface of the second die, wherein a length of the set of pins is modifiable to accommodate height tolerances in a socket stack up between the printed circuit board and the electronic package. - View Dependent Claims (2, 4, 5, 6, 7, 8, 9, 25)
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3. An apparatus comprising:
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a first die mounted on a primary side of an electronic package; a second die mounted on a secondary side of the electronic package, between the electronic package and a printed circuit board; and a thermal component thermally coupled to the second die and the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board, wherein a length of the set of pins is modifiable to accommodate height tolerances in a socket stack up between the printed circuit board and the electronic package, wherein the pins occupy about 15 percent or less of a surface area of a portion of a surface of the printed circuit board.
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10. A system comprising:
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an electronic appliance comprising; a first die having a first side mounted on a primary side of an electronic package, the first die having a second side coupled to a first heat spreader; a second die mounted on a secondary side of the electronic package between the electronic package and a primary side of a printed circuit board; the printed circuit board mounted in parallel to the second die, the printed circuit board comprising the primary side and a secondary side opposite the primary side; a thermal component thermally coupled to the second die, the thermal component comprising a heat sink and a set of pins, the heat sink mounted to the secondary side of the printed circuit board and the set of pins extending from the heat sink through a set of through-holes in the printed circuit board and thermally coupled to a surface of the second die; and a thermal interface material coupled between the thermal component and the second die. - View Dependent Claims (11, 12, 13, 14, 26)
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15. A method comprising:
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positioning a set of thermal connectors through a set of plated through-holes formed in a printed circuit board, the set of thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side wherein the thermal connectors occupy about 15 percent or less of a surface area of a portion of a surface of the printed circuit board; and thermally coupling the set of thermal connectors to a surface of a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification