Thermal management of dies on a secondary side of a package

• US 7,646,093 B2
• Filed: 12/20/2006
• Issued: 01/12/2010
• Est. Priority Date: 12/20/2006
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Hu, Chuan, Braunisch, Henning, Bragado, Gloria Alejandra Camacho
• Primary Examiner(s): Purvis; Sue A.
• Assistant Examiner(s): SODERHOLM, KRISTA Z
• Application Number:
  US11/613,523
• Publication Number:
  US 20080150125A1
• Time in Patent Office: 1,119 Days
• Field of Search: 257/717
• US Class Current: 257/718
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0206 : by printed thermal vias
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/066 : Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 2201/10303 : Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10477 : Inverted
• CPC Class Codes: H05K 2201/10674 : Flip chip

Abstract

An apparatus including a first die mounted on a primary side of an electronic package and a second die mounted on a secondary side of the electronic package between the electronic package and a printed circuit board. The apparatus further comprising a thermal component thermally connected to the second die and mounted on the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board. A method including positioning a set of thermal connectors through a printed circuit board, the thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side. The method further including thermally connecting the thermal connectors to a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board.

Claims

1. An apparatus comprising:

a first die having a first side mounted on a primary side of an electronic package, the first die having a second side coupled to a first heat spreader;

a second die mounted on a secondary side of the electronic package, between the electronic package and a first side of a printed circuit board; and

a thermal component thermally coupled to the second die and a second side of the printed circuit board, the thermal component comprising a set of pins extending from a second heat sink through a set of through-holes in the printed circuit board and thermally coupled to a surface of the second die, wherein a length of the set of pins is modifiable to accommodate height tolerances in a socket stack up between the printed circuit board and the electronic package.

2. The apparatus of claim 1, the thermal component further comprising:

a second heat spreader coupled to the set of pins.

4. The apparatus of claim 1, further comprising:

a thermal interface material coupled between the second die and the thermal component.

5. The apparatus of claim 1, wherein a length of the set of pins is at least equivalent to a thickness of the printed circuit board.

6. The apparatus of claim 1, wherein the set of pins are spring connected to the heat sink.

7. The apparatus of claim 1, further comprising:

a heat pipe coupled to the thermal component.

8. The apparatus of claim 1, wherein the thermal component is electrically coupled to the printed circuit board.

9. The apparatus of claim 4, wherein the thermal interface material comprises a composite containing metal nanoparticles.

25. The apparatus of claim 2 further comprising:

the second die coupled to the electronic package at a location opposing the location of the first die; and

the set of pins thermally coupled to a third heat spreader coupled between the printed circuit board and the surface of the second die.

3. An apparatus comprising:

a first die mounted on a primary side of an electronic package;

a second die mounted on a secondary side of the electronic package, between the electronic package and a printed circuit board; and

a thermal component thermally coupled to the second die and the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board, wherein a length of the set of pins is modifiable to accommodate height tolerances in a socket stack up between the printed circuit board and the electronic package, wherein the pins occupy about 15 percent or less of a surface area of a portion of a surface of the printed circuit board.

10. A system comprising:

an electronic appliance comprising;

a first die having a first side mounted on a primary side of an electronic package, the first die having a second side coupled to a first heat spreader;

a second die mounted on a secondary side of the electronic package between the electronic package and a primary side of a printed circuit board;

the printed circuit board mounted in parallel to the second die, the printed circuit board comprising the primary side and a secondary side opposite the primary side;

a thermal component thermally coupled to the second die, the thermal component comprising a heat sink and a set of pins, the heat sink mounted to the secondary side of the printed circuit board and the set of pins extending from the heat sink through a set of through-holes in the printed circuit board and thermally coupled to a surface of the second die; and

a thermal interface material coupled between the thermal component and the second die.

11. The system of claim 10, the thermal component further comprising:

a second heat spreader directly coupled to the set of pins and the thermal interface material.

12. The system of claim 10, wherein the thermal component is electrically coupled to the printed circuit board.

13. The system of claim 10, wherein the thermal interface material comprises a composite containing metal nanoparticles.

14. The system of claim 10, wherein one of the thermal interface material or the set of pins is of a dimension to compensate for height tolerances in a socket stack up between the printed circuit board and the electronic package.

26. The system of claim 10, wherein the pins occupy about 15 percent or less of a surface area of a portion of a surface of the printed circuit board.

15. A method comprising:

positioning a set of thermal connectors through a set of plated through-holes formed in a printed circuit board, the set of thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side wherein the thermal connectors occupy about 15 percent or less of a surface area of a portion of a surface of the printed circuit board; and

thermally coupling the set of thermal connectors to a surface of a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board.

16. The method of claim 15, wherein the thermal connectors are pins.

17. The method of claim 15, wherein the thermal connectors are filled through-vias in the printed circuit board.

18. The method of claim 15, further comprising:

thermally coupling a heat sink to ends of the set of thermal connectors adjacent the secondary side of the printed circuit board.

19. The method of claim 15, further comprising:

thermally coupling the thermal connectors to the die by coupling a heat spreader to the thermal connectors and the die.

20. The method of claim 15, further comprising:

applying a thermal interface material between the die to enhance thermal contact between the die and the thermal connectors.

21. The method of claim 19, further comprising:

applying a thermal interface material to the heat spreader.

22. The method of claim 20, wherein the thermal interface material comprises a composite containing metal nanoparticles.

23. The method of claim 15, wherein the set of plated through-holes are plated with a conductive material to electrically couple the thermal component to the printed circuit board.

24. The method of claim 15, further comprising:

coupling a heat pipe to the set of thermal connectors.