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Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device

  • US 7,646,582 B2
  • Filed: 10/05/2005
  • Issued: 01/12/2010
  • Est. Priority Date: 10/08/2004
  • Status: Active Grant
First Claim
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1. A micro-electromechanical device comprising:

  • a semiconductor body;

    a first microstructure, including a first suspended mass, integrated in said body; and

    a second microstructure of reference, including a second suspended mass, integrated in said body and arranged so that said first microstructure and said second microstructure undergo equal strains as a result of thermal expansions of said body.

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