Semiconductor device with three-dimensional array structure
First Claim
1. A semiconductor memory device comprising:
- a memory cell array including first and second memory cell blocks on respective first and second semiconductor layers, wherein the first memory cell block includes a first plurality of word lines on the first semiconductor layer including a first word line of the first plurality coupled to a first row of memory cells on the first semiconductor layer, wherein the second memory cell block includes a second plurality of word lines on the second semiconductor layer including a second word line of the second plurality coupled to a second row of memory cells on the second semiconductor layer, wherein the first plurality of word lines including the first word line is between the first and second semiconductor layers, and wherein the second semiconductor layer is between the first plurality of word lines and the second plurality of word lines;
a first row decoder adjacent the memory cell array wherein the first row decoder is configured to control the first word line;
a second row decoder adjacent the memory cell array wherein the second row decoder is configured to control the second word line;
a first wiring electrically connecting the first row decoder and the first word line, the first wiring including a first word line contact electrically contacting the first word line in a direction perpendicular with respect to the first semiconductor layer, a first metal line electrically connected to the first word line contact in a direction parallel with respect to the first semiconductor layer, and a first decoder contact electrically connected between the first metal line and the first decoder in a direction perpendicular with respect to the first semiconductor layer;
a second wiring electrically connecting the second row decoder and the second word line; and
an insulating layer on the second semiconductor layer and on the second word line wherein the second semiconductor layer is between the first semiconductor layer and the insulating layer,wherein the first metal line is disposed on the insulating layer so that the insulating layer is between the first metal line and the first row decoder.
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Accused Products
Abstract
A semiconductor memory device including a memory cell array, a first row decoder adjacent the memory cell array, and a second row decoder adjacent the memory cell array. A memory cell array may include first and second memory cell blocks on respective first and second semiconductor layers. The first memory cell block may include a first word line coupled to a first row of memory cells on the first semiconductor layer, the second memory cell block may include a second word line coupled to a second row of memory cells on the second semiconductor layer, and the first word line may be between the first and second semiconductor layers. The first row decoder may be configured to control the first word line, and the second row decoder may be configured to control the second word line. A first wiring may electrically connect the first row decoder and the first word line, and a second wiring may electrically connect the second row decoder and the second word line.
39 Citations
24 Claims
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1. A semiconductor memory device comprising:
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a memory cell array including first and second memory cell blocks on respective first and second semiconductor layers, wherein the first memory cell block includes a first plurality of word lines on the first semiconductor layer including a first word line of the first plurality coupled to a first row of memory cells on the first semiconductor layer, wherein the second memory cell block includes a second plurality of word lines on the second semiconductor layer including a second word line of the second plurality coupled to a second row of memory cells on the second semiconductor layer, wherein the first plurality of word lines including the first word line is between the first and second semiconductor layers, and wherein the second semiconductor layer is between the first plurality of word lines and the second plurality of word lines; a first row decoder adjacent the memory cell array wherein the first row decoder is configured to control the first word line; a second row decoder adjacent the memory cell array wherein the second row decoder is configured to control the second word line; a first wiring electrically connecting the first row decoder and the first word line, the first wiring including a first word line contact electrically contacting the first word line in a direction perpendicular with respect to the first semiconductor layer, a first metal line electrically connected to the first word line contact in a direction parallel with respect to the first semiconductor layer, and a first decoder contact electrically connected between the first metal line and the first decoder in a direction perpendicular with respect to the first semiconductor layer; a second wiring electrically connecting the second row decoder and the second word line; and an insulating layer on the second semiconductor layer and on the second word line wherein the second semiconductor layer is between the first semiconductor layer and the insulating layer, wherein the first metal line is disposed on the insulating layer so that the insulating layer is between the first metal line and the first row decoder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A semiconductor memory device comprising:
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a memory cell array including a memory cell block, wherein the memory cell block includes a first word line on a first semiconductor layer wherein the first word line is coupled to a first row of memory cells and a second word line coupled on a second semiconductor layer wherein the second word line is coupled to a second row of memory cells, and wherein the first word line is between the first and second semiconductor layers; an odd row decoder adjacent the memory cell array wherein the odd row decoder is configured to control the first word line; an even row decoder adjacent the memory cell array wherein the even row decoder is configured to control the second word line wherein the memory cell array is between the odd and even row decoders; a first wiring electrically connecting the odd row decoder and the first word line; and a second wiring electrically connecting the even row decoder and the second word line.
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24. A semiconductor memory device comprising:
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a memory cell array including first and second memory cell blocks on respective first and second semiconductor layers, wherein the first and second memory cell blocks include respective first and second pluralities of word lines, wherein the first plurality of word lines are coupled to respective first rows of memory cells on the first semiconductor layer, wherein the second pluralities of word lines are coupled to respective second rows of memory cells on the second semiconductor layer, and wherein the first word line is between the first and second semiconductor layers; a row decoder adjacent the memory cell array wherein the row decoder is configured to control a first word line of the first plurality of word lines and a second word line of the second plurality of word lines; and a wiring electrically connecting the first and second word lines and electrically connecting the first and second word lines with the row decoder.
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Specification