Method and system for problem case packaging

• US 7,647,132 B2
• Filed: 05/05/2004
• Issued: 01/12/2010
• Est. Priority Date: 05/05/2004
• Status: Expired due to Fees

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Kuo, Wen-Chang, Huang, Chien-Chung, Chen, Chun Yi, Huang, Yi-Lin, Wang, Dan-Ru, Chiang, Tien-Der
• Primary Examiner(s): Kasenge; Charles R
• Application Number:
  US10/839,426
• Publication Number:
  US 20050251277A1
• Time in Patent Office: 2,078 Days
• Field of Search: 702/182, 702/183, 702/184, 702/185, 702/35, 702 81- 84, 702/108, 702/117, 702/118, 700/95, 700/99, 700/100, 700/102, 700108-110, 700/121, 700/174, 700/10, 700/74, 707/10, 707/100, 707/104.1, 382/145, 382/149, 345/224, 345/145, 345/149
• US Class Current: 700/110
• CPC Class Codes: G06Q 10/08 Logistics, e.g. warehousing, loading or distribution; Inventory or stock management

Abstract

A method of problem case packaging handling consists collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and being associated with manufacturing problem information related to that problem case.

Claims

1. A method of problem case packaging handling comprising:

collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and

distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and having a tree structure that includes a plurality of different branches that represent respective different aspects of the corresponding problem case, each said branch being associated with manufacturing problem information related to that branch;

wherein the tree structure of one of the problem cases, beginning at the root, is problem-process-tool-product.

2. The method of claim 1 wherein the manufacturing problem information includes problem source information.

3. The method of claim 1 wherein the manufacturing problem information includes process problems.

4. The method of claim 3, wherein each of the process problems is one of mis-processing, double processing, and cross processing by human error.

5. The method of claim 1 wherein the manufacturing problem information includes tool problems.

6. The method of claim 5, wherein each of the tool problems is one of a mechanical malfunction, an inconsistent processing result, and an out-of-specification processing parameter.

7. The method of claim 1 wherein the distribution step includes distributing the manufacturing problem information over respective organizations involved in manufacturing the semiconductor product.

8. The method of claim 1 further including prioritizing the distributed manufacturing problem information.

9. The method of claim 8, wherein the prioritizing includes prioritizing the distributed identified problems according to problem frequency.

10. The method of claim 8, wherein the prioritizing includes prioritizing the distributed identified problems according to criticality.

11. The method of claim 1 further including correlating first manufacturing problem information with second manufacturing problem information.

12. The method of claim 1 further including tracking a problem case over its lifetime.

13. The method of claim 1 wherein the manufacturing problem information includes product information regarding the particular product affected in a problem case.

14. The method of claim 1, wherein the manufacturing problem information includes a material problem selected from the group consisting of material contamination, an out-of-specification material, an incorrect type of material, supplier quality problem, a beyond-shelf-life material, a material degradation, and an out-of-storage-condition material.

15. A method of problem case packaging handling comprising:

collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and

distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and having a tree structure that includes a plurality of different branches that represent respective different aspects of the corresponding problem case, each said branch being associated with manufacturing problem information related to that branch;

wherein the tree structure of one of the problem cases, beginning at the root, is problem-tool-process-product.

16. The method of claim 15 wherein the manufacturing problem information includes product information regarding the particular product affected in a problem case.

17. A method of problem case packaging handling comprising:

collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and

distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and having a tree structure that includes a plurality of different branches that represent respective different aspects of the corresponding problem case, each said branch being associated with manufacturing problem information related to that branch;

wherein the tree structure of one of the problem cases, beginning at the root, is problem-product-process-tool.

18. The method of claim 17 wherein the manufacturing problem information comprises an element selected from the group consisting of tool alarm messages, tool status, product defects, out of specification (OOS) information, statistic process control (SPC) chart data, product processing information, product test results which include wafer acceptance test (WAT) results and wafer level reliability (WLR) test results, wafer scrapping data, yield data, yield mapping pattern and daily tool qualification information.