Filled dielectric on metal pressure sensor

• US 7,647,833 B1
• Filed: 08/19/2008
• Issued: 01/19/2010
• Est. Priority Date: 08/19/2008
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Oboodi, Reeza, Piascik, James, Ricks, Lamar Floyd
• Primary Examiner(s): Allen; Andre J
• Application Number:
  US12/194,339
• Time in Patent Office: 518 Days
• Field of Search: None
• US Class Current: 73/721
• CPC Class Codes: G01L 9/0044 Constructional details of non-semiconductive diaphragms
• CPC Class Codes: G01L 9/0052 of piezoresistive elements circuits therefor G01L9/06

Abstract

A pressure sensing apparatus (1) includes an elastically deformable pressure-sensitive diaphragm assembly (13) having a pressure-sensitive metal or metal alloy diaphragm (14). A functional filled dielectric layer (25) is on the diaphragm and includes a base dielectric material and at least one CTE raising filler. A CTE of the functional filled dielectric layer provides a CTE @ 800° C.≧8 ppm/° C., such as ≧10 ppm/° C. A plurality of piezoresistive elements (27) are on the functional filled dielectric layer (25).

Claims

1. A pressure sensing apparatus comprising:

a pressure port having an upper surface and a base portion;

an elastically deformable pressure-sensitive diaphragm assembly having an upper surface, lower surface and a pressure-sensitive diaphragm;

said lower surface of said diaphragm assembly being attached onto said upper surface of the pressure port, wherein said diaphragm comprises a metal or metal alloy;

a functional filled dielectric layer on said diaphragm comprising a base dielectric material and at least one CTE raising filler, a CTE of said functional filled dielectric layer having a CTE @ 800°

C.≧

8 ppm/°

C., and

a plurality of piezoresistive elements on said functional filled dielectric dielectric layer.

2. The apparatus of claim 1, wherein said CTE of said functional filled dielectric layer is ≧

10 ppm/°

C.

3. The apparatus of claim 1, wherein said diaphragm is integrally formed from a single material with said diaphragm assembly.

4. The apparatus of claim 1, wherein said filler comprises 10 to 30% by weight of said filled dielectric layer.

5. The apparatus of claim 1, wherein said diaphragm assembly comprises a steel.

6. The apparatus of claim 5, wherein a CTE match @ 800°

C. between said steel and said functional filled dielectric layer is ≦

2 ppm/°

C.

7. The apparatus of claim 1, wherein said filler comprises at least one of yttria stabilized zirconia (YSZ), zinc oxide/silica glass, a mica, or a glass comprising material including a plurality of different oxides.

8. The apparatus of claim 1, wherein said piezoresistive elements are arranged in a bridge circuit configuration.

9. The apparatus of claim 1, wherein said functional filled dielectric layer is molecularly bonded to said diaphragm.

10. A method for forming a pressure sensing apparatus, comprising:

bonding a metal or metal alloy comprising diaphragm assembly including diaphragm to a functional filled dielectric layer to form a dielectric surface thereof, said functional filled dielectric layer comprising a base dielectric material and at least one CTE raising filler, a CTE of said functional filled dielectric layer having a CTE @ 800°

C.≧

8 ppm/°

C.;

forming a bridge circuit comprising a plurality of piezoelectric elements on said dielectric surface;

providing an input pressure port for pressure sensing thereof, wherein said input pressure port is connected to said diaphragm to form said pressure sensing apparatus.

11. The method of claim 10, wherein said bonding comprises molecular bonding.

12. The method of claim 10, wherein said CTE of said functional filled dielectric layer 250 is ≧

10 ppm/°

C.

13. The method of claim 10, wherein filler comprises 10 to 30% by weight of said functional filled dielectric layer.

14. The method of claim 10, wherein said diaphragm assembly comprises a steel.

15. The method of claim 14, wherein a CTE match @ 800°

C. between said steel and said functional filled dielectric layer is ≧

2 ppm/°

C.

16. The method of claim 10, wherein said filler comprises at least one of yttria stabilized zirconia (YSZ), zinc oxide/silica glass, a mica, or a glass comprising a plurality of oxides.