Method and apparatus for removing contamination from substrate

• US 7,648,584 B2
• Filed: 01/20/2006
• Issued: 01/19/2010
• Est. Priority Date: 06/27/2003
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Korolik, Mikhail, de Larios, John M., Redeker, Fred C., Mikhaylichenko, Katrina, Freer, Erik M., Ravkin, Michael, Parks, John, Thomas, Clint
• Primary Examiner(s): Kornakov; Michael
• Assistant Examiner(s): GOLIGHTLY, ERIC WAYNE
• Application Number:
  US11/336,215
• Publication Number:
  US 20070079848A1
• Time in Patent Office: 1,460 Days
• Field of Search: None
• US Class Current: 134/6
• CPC Class Codes: B05D 3/10 by other chemical means
• CPC Class Codes: B08B 7/02 by distortion, beating, or vibration of the surface to be cleaned B08B7/0007 takes precedence
• CPC Class Codes: C11D 1/04 Carboxylic acids or salts thereof soap C11D9/00
• CPC Class Codes: C11D 17/0004 Non aqueous liquid compositions comprising insoluble particles
• CPC Class Codes: C11D 17/0013 Liquid compositions with insoluble particles in suspension C11D17/0021, C11D17/0026, C11D17/003 take precedence
• CPC Class Codes: C11D 17/0017 Multi-phase liquid compositions
• CPC Class Codes: C11D 17/003 Colloidal solutions, e.g. gels; Thixotropic solutions or pastes
• CPC Class Codes: C11D 17/041 Compositions releasably affixed on a substrate or incorporated into a dispensing means
• CPC Class Codes: C11D 2111/22 Electronic devices, e.g. PCBs or semiconductors
• CPC Class Codes: C11D 3/042 Acids
• CPC Class Codes: C11D 3/044 Hydroxides or bases
• CPC Class Codes: C11D 3/14 Fillers; Abrasives ; Abrasive compositions; Suspending or absorbing agents not provided for in one single group of C11D3/12; Specific features concerning abrasives, e.g. granulometry or mixtures dyes, pigments C11D3/40
• CPC Class Codes: C11D 3/18 Hydrocarbons C11D3/164 takes precedence
• CPC Class Codes: C11D 3/2079 Monocarboxylic acids-salts thereof
• CPC Class Codes: C11D 3/222 Natural or synthetic polysaccharides, e.g. cellulose, starch, gum, alginic acid or cyclodextrin
• CPC Class Codes: C11D 3/225 etherified, e.g. CMC
• CPC Class Codes: C11D 3/3765 in liquid compositions
• CPC Class Codes: C11D 9/00 Compositions of detergents based essentially on soap compositions containing resin soap C11D15/04
• CPC Class Codes: C11D 9/02 on alkali or ammonium soaps
• CPC Class Codes: C11D 9/267 containing free fatty acids
• CPC Class Codes: C23G 1/00 : Cleaning or pickling metallic material with solutions or molten salts with organic solvents C23G5/02
• CPC Class Codes: C23G 1/18 : Organic inhibitors
• CPC Class Codes: G03F 7/42 : Stripping or agents therefor
• CPC Class Codes: G03F 7/423 : containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
• CPC Class Codes: H01L 21/02052 : Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/02057 : Cleaning during device manufacture
• CPC Class Codes: H01L 21/02096 : only mechanical cleaning
• CPC Class Codes: H01L 21/31133 : by chemical means
• CPC Class Codes: H01L 21/67051 : using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67057 : with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: H01L 21/6708 : using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67086 : with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: H01L 21/6715 : Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence

Abstract

A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

Claims

1. A method for removing contamination from a substrate, comprising:

disposing a cleaning material over a substrate, the cleaning material including a plurality of solid components dispersed within a liquid medium;

applying a force to a solid component of the plurality of solid components to bring the solid component within proximity to a contaminant present on the substrate such that a mechanical linkage is established between the solid component and the contaminant so as to bind the contaminant to the solid component wherein the mechanical linkage is created by deformation of the solid component due to imprinting by the contaminant; and

moving the solid component away from the substrate such that the contaminant mechanically linked to the solid component is removed from the substrate into the liquid medium, wherein the contaminant remains mechanically linked to the solid component within the liquid medium.

2. A method for removing contamination from a substrate as recited in claim 1, wherein the plurality of solid components are dispersed in suspension within the liquid medium.

3. A method for removing contamination from a substrate as recited in claim 1, wherein the plurality of solid components are defined to avoid damaging the substrate and to avoid adherence to the substrate.

4. A method for removing contamination from a substrate as recited in claim 1, wherein the solid component is a crystalline solid.

5. A method for removing contamination from a substrate as recited in claim 1, wherein the solid component is a non-crystalline solid.

6. A method for removing contamination from a substrate as recited in claim 1, wherein the solid component is either an aliphatic acid, a carboxylic acid, a polymer, a wax, a paraffin, a polystyrene, a polypeptide, or a visco-elastic material.

7. A method for removing contamination from a substrate as recited in claim 1, wherein the solid component is either an agglutination, a coagulation, a flocculation, an agglomeration, or a coalescence.

8. A method for removing contamination from a substrate as recited in claim 1, wherein a portion of the plurality of solid components form a network of solid components within the liquid medium, wherein mechanical stress transferred through the network of solid components establishes the mechanical linkage between the solid component and the contaminant.

9. A method for removing contamination from a substrate as recited in claim 1, wherein the liquid medium is aqueous.

10. A method for removing contamination from a substrate as recited in claim 1, wherein the liquid medium is non-aqueous.

19. A method for removing contamination from a substrate as recited in claim 1, wherein the interaction between the solid component and the contaminant is established by one or more of adhesive forces, collision forces, and attractive forces.

20. A method for removing contamination from a substrate as recited in claim 1, further comprising:

modifying a chemistry of the liquid medium to enhance mechanical linkage between the solid component and the contaminant.

21. A method for removing contamination from a substrate as recited in claim 1, further comprising:

controlling a temperature of the cleaning material to enhance mechanical linkage between the solid component and the contaminant.

22. A method for removing contamination from a substrate as recited in claim 1, further comprising:

controlling a flow rate of the cleaning material over the substrate to control movement of the solid component away from the substrate.

23. A method for removing contamination from a substrate as recited in claim 1, wherein the substrate is a semiconductor wafer.

24. A method for removing contamination from a substrate as recited in claim 1, further comprising:

controlling a temperature of the liquid medium to enable formation of the plurality of solid components within the liquid medium in-situ on the substrate.

25. A method for removing contamination from a substrate as recited in claim 1, further comprising:

introducing a precipitant to the liquid medium to cause formation of the plurality of solid components within the liquid medium.

26. A method for removing contamination from a substrate as recited in claim 25, wherein the solid components are dissolved in a solvent within the liquid medium prior to introducing the precipitant, the precipitant being miscible with the solvent and immiscible with the solid components.

11. A method for removing contamination from a substrate, comprising:

disposing a cleaning material over a substrate, the cleaning material including a plurality of solid components dispersed within a liquid medium;

applying a force to a solid component of the plurality of solid components to bring the solid component within proximity to a contaminant present on the substrate such that a mechanical linkage is established between the solid component and the contaminant so as to bind the contaminant to the solid component wherein the mechanical linkage is created by deformation of the solid component due to imprinting by the contaminant; and

moving the solid component away from the substrate such that the contaminant mechanically linked to the solid component is removed from the substrate into the liquid medium, wherein the contaminant remains mechanically linked to the solid component within the liquid medium,

wherein the cleaning material further includes a plurality of immiscible components defined to apply the force to the solid component to bring the solid component within proximity to the contaminant such that the mechanical linkage is established between the solid component and the contaminant.

12. A method for removing contamination from a substrate as recited in claim 11, further comprising:

controlling the immiscible components to apply a controlled amount of force to the solid component.

13. A method for removing contamination from a substrate as recited in claim 11, wherein the immiscible components are defined as gas bubbles within the liquid medium.

14. A method for removing contamination from a substrate as recited in claim 11, wherein the immiscible components are defined as liquid droplets within the liquid medium.

15. A method for removing contamination from a substrate as recited in claim 11, wherein the plurality of immiscible components is defined as a mixture of immiscible components, each immiscible component within the mixture of immiscible components having either a common physical state or a different physical state.

16. A method for removing contamination from a substrate as recited in claim 11, wherein the immiscible components are defined within the liquid medium prior to disposing the cleaning material over the substrate.

17. A method for removing contamination from a substrate as recited in claim 11, further comprising:

forming the immiscible components within the liquid medium following disposing the cleaning material over the substrate.

18. A method for removing contamination from a substrate as recited in claim 17, wherein the immiscible components are formed from a dissolved gas within the liquid medium upon a decrease in ambient pressure relative to the cleaning material.

27. A method for removing contamination from a substrate as recited in claim 11, wherein the solid component is surface active and is pulled into an interface region between an immiscible component of the plurality of immiscible components and the liquid medium such that the solid component with the contaminant mechanically linked thereto is adsorbed to the interface region.