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Solid state detector packaging technique

  • US 7,649,178 B2
  • Filed: 08/02/2005
  • Issued: 01/19/2010
  • Est. Priority Date: 08/13/2004
  • Status: Expired due to Fees
First Claim
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1. A radiation detector package comprising:

  • a radiation sensing solid state element;

    a first electrode disposed on a first principal surface of the solid state element;

    a pixelated second electrode disposed on a second principal surface of the solid state element opposite the first principal surface;

    an electronics board receiving an electrical signal from the solid state element responsive to radiation incident upon the radiation sensitive solid state element;

    a light tight shield shielding at least the radiation sensitive solid state element from light exposure and compressively maintaining the radiation-sensing element and the electronics based in a preselected, electrically interconnected relationship; and

    at least one electrically conductive membrane disposed between the pixelated second electrode and the electronics board, the electrically conductive membrane providing electrical connection between pixels of the pixelated second electrode and corresponding electrical pads of the electronics board; and

    a thermally conductive plate in thermal communication with elements of the electronics board, the light tight shield and the thermally conductive plate being connected together, the radiation sensitive solid state element, electronics board, and electrically conductive membrane being compressively held between the connected thermally conductive plate and light tight shield.

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