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Side-view surface mount white LED

  • US 7,649,209 B2
  • Filed: 04/24/2007
  • Issued: 01/19/2010
  • Est. Priority Date: 04/24/2006
  • Status: Active Grant
First Claim
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1. A light emitting diode comprising:

  • a package support;

    a semiconductor chip on said package support, said chip including an active region that emits radiation in the visible or UV portion of the spectrum;

    metal contacts in electrical communication with said chip on said package;

    a substantially transparent encapsulant covering said chip in said package;

    a phosphor in said encapsulant that emits radiation in the visible spectrum different from the radiation emitted by said chip and in response to the wavelength emitted by said chip; and

    a diffuser distributed in a pre-form and with said pre-form positioned within said encapsulant adjacent said diode.

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