Side-view surface mount white LED
First Claim
1. A light emitting diode comprising:
- a package support;
a semiconductor chip on said package support, said chip including an active region that emits radiation in the visible or UV portion of the spectrum;
metal contacts in electrical communication with said chip on said package;
a substantially transparent encapsulant covering said chip in said package;
a phosphor in said encapsulant that emits radiation in the visible spectrum different from the radiation emitted by said chip and in response to the wavelength emitted by said chip; and
a diffuser distributed in a pre-form and with said pre-form positioned within said encapsulant adjacent said diode.
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Accused Products
Abstract
A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
71 Citations
20 Claims
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1. A light emitting diode comprising:
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a package support; a semiconductor chip on said package support, said chip including an active region that emits radiation in the visible or UV portion of the spectrum; metal contacts in electrical communication with said chip on said package;
a substantially transparent encapsulant covering said chip in said package;a phosphor in said encapsulant that emits radiation in the visible spectrum different from the radiation emitted by said chip and in response to the wavelength emitted by said chip; and a diffuser distributed in a pre-form and with said pre-form positioned within said encapsulant adjacent said diode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A display element comprising the combination of a light emitting diode and a planar display element, the combination comprising:
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a substantially planar display element; a light emitting diode positioned on the perimeter of said display element and including; a reflective package support that directs the output of said diode substantially parallel to the plane of said display element; a semiconductor chip on said reflective package support, said chip including an active region that emits radiation in the visible or UV portion of the spectrum; metal contacts in electrical communication with said chip on said reflective package; a substantially transparent encapsulant covering said chip in said reflective package, said encapsulant forming a negative meniscus; and
;a phosphor in said encapsulant that emits radiation in the visible spectrum different from the radiation emitted by said chip and in response to the wavelength emitted by said chip. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A light emitting diode comprising:
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a package support; a semiconductor chip on said package support, said chip including an active region that emits radiation in the visible or UV portion of the spectrum; metal contacts in electrical communication with said chip on said package;
a substantially transparent encapsulant covering said chip in said package; anda phosphor in said encapsulant that emits radiation in the visible spectrum different from the radiation emitted by said chip and in response to the wavelength emitted by said chip, with more than 50 percent of the phosphor positioned in the lower 25 percent of the encapsulant. - View Dependent Claims (16, 17)
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18. A light emitting diode comprising:
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a package support; a semiconductor chip on said package support, said chip including an active region that emits radiation in the visible or UV portion of the spectrum; metal contacts in electrical communication with said chip on said package; a substantially transparent encapsulant covering said chip in said package; a phosphor in said encapsulant that emits radiation in the visible spectrum different from the radiation emitted by said chip and in response to the wavelength emitted by said chip; and a physical spacer element between said chip and said phosphor. - View Dependent Claims (19, 20)
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Specification