Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
First Claim
Patent Images
1. A thin film semiconductor chip, comprising:
- an active layer stack configured to generate electromagnetic radiation;
an electrically conductive reflective contact material layer disposed on the active layer stack; and
a carrier layer, wherein the carrier layer is a prefabricated flexible electrically conductive foil disposed on the electrically conductive reflective contact material layer, said flexible electrically conductive foil having a thickness of less than 100 μ
m and being joined to the active layer stack.
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Abstract
For semiconductor chips (1) using thin film technology, an active layer sequence (20) is applied to a growth substrate (3), on which a reflective electrically conductive contact material layer (40) is then formed. The active layer sequence is patterned to form active layer stacks (2), and reflective electrically conductive contact material layer (40) is patterned to be located on each active layer stack (2). Then, a flexible, electrically conductive foil (6) is applied to the contact material layers as an auxiliary carrier layer, and the growth substrate is removed.
20 Citations
12 Claims
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1. A thin film semiconductor chip, comprising:
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an active layer stack configured to generate electromagnetic radiation; an electrically conductive reflective contact material layer disposed on the active layer stack; and a carrier layer, wherein the carrier layer is a prefabricated flexible electrically conductive foil disposed on the electrically conductive reflective contact material layer, said flexible electrically conductive foil having a thickness of less than 100 μ
m and being joined to the active layer stack. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A thin film semiconductor chip comprising:
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an active layer stack configured for generating electromagnetic radiation; an electrically conductive reflective contact material layer disposed on the active layer stack; and a carrier layer, wherein the carrier layer is a prefabricated flexible electrically conductive foil disposed on the electrically conductive reflective contact material layer; wherein the thin film semiconductor chip has a total thickness of less than 100 μ
m. - View Dependent Claims (12)
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Specification