×

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

  • US 7,649,266 B2
  • Filed: 08/01/2005
  • Issued: 01/19/2010
  • Est. Priority Date: 07/30/2004
  • Status: Active Grant
First Claim
Patent Images

1. A thin film semiconductor chip, comprising:

  • an active layer stack configured to generate electromagnetic radiation;

    an electrically conductive reflective contact material layer disposed on the active layer stack; and

    a carrier layer, wherein the carrier layer is a prefabricated flexible electrically conductive foil disposed on the electrically conductive reflective contact material layer, said flexible electrically conductive foil having a thickness of less than 100 μ

    m and being joined to the active layer stack.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×