Method and apparatus for switching tester resources

• US 7,649,366 B2
• Filed: 09/01/2006
• Issued: 01/19/2010
• Est. Priority Date: 09/01/2006
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Sporck, A. Nicholas, Henson, Roy J.
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Vazquez; Arleen M
• Application Number:
  US11/469,788
• Publication Number:
  US 20080054917A1
• Time in Patent Office: 1,236 Days
• Field of Search: 324/754, 324/761, 324/765, 324/158.1
• US Class Current: 324/754.03
• CPC Class Codes: G01R 1/07385 using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence

Abstract

A contactor device comprising a plurality of probes disposed to contact ones of the electronic devices can be electrically connected to a source of test signals. A switch can be activated electrically connecting a connection to the source of test signals to a selected one of a first group of electrically connected ones of the probes disposed to contact a first set of a plurality of the electronic devices or a second group of electrically connected ones of the probes disposed to contact a second set of a plurality of the electronic devices.

Claims

1. A probe card assembly comprising:

a mounting structure by which said probe card assembly can be attached to and detached from a prober;

an electrical interface comprising N electrical connections configured to make connections with N communications channels from a tester;

a plurality of M probes secured to said mounting structure and further disposed in a pattern that corresponds to a pattern of contact terminals of a plurality of electronic devices to be tested, wherein M is greater than N;

a plurality of electrical connections directly connecting first ones of the plurality of M probes to the electrical interface wherein each one of the electrical connections connects one of the first ones of the plurality of M probes to one of the electrical connections of the interface; and

a plurality of switches selectively connecting second ones of the plurality of M probes to the electrical interface wherein ones of the switches connect selectively one of a first set of the second ones of the plurality of M probes and a second set of the second ones of the plurality of M probes to a set of the electrical connections of the interface such that only one of the first set or the second set is connected to the set of the electrical connections of the interface at a time,

wherein the first set of the second ones of the plurality of M probes are disposed in the pattern of the M probes to correspond to contact terminals of a first one of the electronic devices, and the second set of the second ones of the plurality of M probes are disposed in the pattern of the M probes to correspond to contact terminals of a second one of the electronic devices.

2. The probe card assembly of claim 1 further comprising:

a wiring substrate comprising the electrical interface; and

a probe substrate comprising the probes.

3. The probe card assembly of claim 2, wherein the switches are disposed on the wiring substrate.

4. The probe card assembly of claim 1, wherein the N electrical connections are sufficient to test X of the electronic devices, and the M probes are sufficient to contact Y of the electronic devices, wherein Y is greater than X.

5. The probe card assembly of claim 4 further comprising a sufficient number of the switches to selectively connect one of a first group and a second group of the probes to the electrical interface while disconnecting the other of the first group and the second group from the electrical interface, wherein each of the first group of probes and the second group of probes comprises at least a number of probes sufficient to contact Y minus X electronic devices.

6. The probe card assembly of claim 1, wherein the tester provides test signal for testing semiconductor dies.

7. The probe card assembly of claim 1, wherein the electrical interface makes electrical connections with electronics in a test head, which is electrically connected to the tester.

8. The probe card assembly of claim 7, wherein the test head comprises a plurality of driver circuits and receiver circuits.

9. The probe card assembly of claim 1, wherein at least one of the switches connects selectively one of a first group of electrically connected probes each configured to contact a different electronic device and a second group of electrically connected probes each configured to contact a different electronic device.

10. The probe card assembly of claim 1, wherein the first set of the second ones of the M probes are disposed in the pattern of the M probes to correspond to contact terminals of a first plurality of the electronic devices, and the second set of the second ones of the plurality of M probes are disposed in the pattern of the M probes to correspond to contact terminals of a second plurality of the electronic devices that does not include the first plurality of electronic devices.

11. The probe card assembly of claim 10, wherein the first ones of the M probes are disposed in the pattern of the M probes to correspond to contact terminals of a third plurality of the electronic devices that does not include the first plurality of electronic devices or the second plurality of electronic devices.

12. The probe card assembly of claim 1, wherein the first ones of the M probes comprise a third set of the M probes disposed in the pattern of the M probes to correspond to a third one of the electronic devices that is different than the first one of the electronic devices and the second one of the electronic devices.

13. A probe card assembly comprising:

a mounting structure by which said probe card assembly can be attached to and detached from a prober;

an electrical interface comprising N electrical connections configured to make connections with N communications channels from a tester;

a wiring substrate coupled to the mounting structure and electrically connected to the electrical interface;

a plurality of M probes disposed on the wiring substrate and arranged to contact terminals of a plurality of electronic devices to be tested, wherein M is greater than N;

a plurality of electrical connections directly connecting first ones of the plurality of M probes to the electrical interface wherein each one of the electrical connections connects one of the first ones of the plurality of M probes to one of the electrical connections of the interface;

a plurality of switches configured to selectively connect second ones of the plurality of M probes to the electrical interface wherein the N electrical connections are sufficient to test X of the electronic devices, and the M probes are sufficient to contact Y of the electronic devices, wherein Y is greater than X; and

the probe card assembly further comprising a sufficient number of switches to selectively connect one of a first group and a second group of the second ones of the plurality of M probes to the electrical interface while disconnecting the other of the first group and the second group from the electrical interface, wherein each of the first group of probes and the second group of probes comprises at least a number of probes sufficient to contact Y minus X electronic devices;

such that said electronic devices are capable of being tested by bringing the electronic devices into contact with said probes.

14. The probe card assembly of claim 13, wherein each of the switches is configured to connect selectively one of a pair of the probes to one of the electrical connections of the interface.

15. The probe card assembly of claim 13, wherein the switches are disposed on the wiring substrate.

16. The probe card assembly of claim 13, wherein the tester is configured to provide test signal for testing semiconductor dies.

17. The probe card assembly of claim 13, wherein the electrical interface is configured to make electrical connections with electronics in a test head, which is electrically connected to the tester.

18. The probe card assembly of claim 17, wherein the test head comprises a plurality of driver circuits and receiver circuits.

19. The probe card assembly of claim 13, wherein at least one of the switches is configured to connect selectively one of a first group of electrically connected probes each configured to contact a different electronic device and a second group of electrically connected probes each configured to contact a different electronic device.

20. The probe card assembly of claim 13, wherein the wiring substrate comprises a first substrate on which the electrical interface is disposed, and the probe card assembly further comprises a second substrate on which the probes are disposed.

21. The probe card assembly of claim 13, wherein the wiring substrate comprises a first substrate on which the electrical interface is disposed, and the probe card assembly further comprises a plurality of second substrates on which the probes are disposed.

22. A probe card assembly comprising:

a mounting structure by which said probe card assembly can be attached to and detached from a prober;

an electrical interface comprising N electrical connections configured to make connections with N communications channels from a tester;

a plurality of M probes secured to said mounting structure and further disposed to contact terminals of a plurality of electronic devices to be tested, wherein M is greater than N;

a plurality of electrical connections directly connecting first ones of the plurality of M probes to the electrical interface wherein each one of the electrical connections connects one of the first ones of the plurality of M probes to one of the electrical connections of the interface; and

a plurality of switches selectively connecting second ones of the plurality of M probes to the electrical interface wherein each one of the switches connects selectively one of a pair of the second ones of the plurality of M probes to one of the electrical connections of the interface,

the probe card assembly further comprising a sufficient number of the switches to selectively connect one of a first group and a second group of the probes to the electrical interface while disconnecting the other of the first group and the second group from the electrical interface, wherein each of the first group of probes and the second group of probes comprises at least a number of probes sufficient to contact Y minus X electronic devices,

wherein the plurality of electrical connections directly connecting the first ones of the plurality of M probes to the electrical interface connect to a third group of the probes different than the first group and the second group.