Method of preparing an antenna

• US 7,650,683 B2
• Filed: 08/30/2006
• Issued: 01/26/2010
• Est. Priority Date: 04/24/2002
• Status: Expired due to Term

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: King, Patrick F., Forster, Ian J.
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US11/468,756
• Publication Number:
  US 20060288563A1
• Time in Patent Office: 1,245 Days
• Field of Search: 296/00, 296/01, 298/32, 295641-5644, 343/700.MS, 343/767, 343/873, 343/676, 340/572.8, 340/568.1, 340/539, 156262- 26, 156290-293, 156/295, 156299-302, 156/463
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Claims

1. A method of preparing an antenna for use with a wireless communication device, the method comprising:

passing a conductive material on an adhesive backing through a first die cut roller configured to make a first cut in the conductive material, the first cut defining a portion of a perimeter of one or more antenna tabs; and

passing the conductive material on an adhesive backing through a second die cut roller configured to make a second cut in the conductive material, the second cut defining a portion of the perimeter of the one or more antenna tabs, wherein the second cut variably overlaps the first cut to adjust a size of the perimeter of the one or more antenna tabs;

wherein the overlap of the cuts made by the first die cut roller and the second die cut roller is adjusted to vary the size of the perimeter of the one or more antenna tabs cut by the die cut rollers.

2. The method of claim 1, wherein the conductive material is a copper foil.

3. The method of claim 1, wherein the conductive material is an aluminum foil.

4. The method of claim 1, further comprising positioning the first die cut roller and the second die cut roller such that the die cut rollers are spaced from the adhesive backing by the conductive material.

5. The method of claim 1, further comprising removing conductive material from outside the perimeter of the one or more antenna tabs from the adhesive backing.

6. The method of claim 1, further comprising adjusting the overlap of the cuts made by the first die cut roller and the second die cut roller based on an electrical characteristic of a substrate.

7. The method of claim 1, further comprising determining the overlap of the cuts made by the first die cut roller and the second die cut roller based on a selected optimum read range at a desired operating frequency.

8. The method of claim 1, further comprising attaching the one or more antenna tabs to a wireless communication device by:

creating fingers on the one or more antenna tabs;

heating pins of a wireless communication chip; and

inserting the pins of the wireless communication chip into a substrate so that the fingers on the one or more antenna tabs wrap around the pins.

9. The method of claim 1, further comprising welding pins of a wireless communication chip to the one or more antenna tabs.

10. The method of claim 9, wherein said welding comprises welding the pins of the wireless communication chip with a low voltage, high current electrical pulse.

11. The method of claim 10, wherein said welding comprises passing the low voltage, high current electrical pulse through the pins of the wireless communication chip.

12. The method of claim 1, further comprising adjusting the overlap of the cuts made by the first die cut roller and the second die cut roller based on a desired capacitance of the one or more antenna tabs.

13. The method of claim 12, wherein adjusting the overlap of the cuts made by the first die cut roller and the second die cut roller based on the desired capacitance of the one or more antenna tabs comprises

adjusting the relative phases of the first die cut roller and the second die cut roller.

14. A method of preparing an antenna for use with a wireless communication device, the method comprising:

passing a conductive material through a first die cut roller configured to make a first cut in the conductive material, the first cut defining a portion of a perimeter of one or more antenna tabs; and

passing the conductive material through a second die cut roller configured to make a second cut in the conductive material, the second cut defining a portion of a perimeter of the one or more antenna tabs, wherein the second cut variably overlaps the first cut to adjust a size of the perimeter of the one or more antenna tabs;

wherein the positions of the first cut and the second cut relative to each other are adjusted to vary the size of the perimeter of the one or more antenna tabs cut by the die cut rollers.

15. The method of claim 14, wherein the conductive material is a copper foil.

16. The method of claim 14, wherein the conductive material is an aluminum foil.

17. The method of claim 14, further comprising adjusting the position of the first cut and the second cut relative to each other based on an electrical characteristic of a substrate.

18. The method of claim 14, further comprising determining the position of the first cut and the second cut relative to each other based on a selected optimum read range at a desired operating frequency.

19. The method of claim 14, further comprising:

creating fingers on the one or more antenna tabs;

heating pins of a wireless communication chip; and

inserting the pins of the wireless communication chip into a substrate so that the fingers on the one or more antenna tabs wrap around the pins.

20. The method of claim 14, further comprising welding pins of a wireless communication chip to the one or more antenna tabs.

21. The method of claim 20, wherein said welding comprises welding the pins of the wireless communication chip with a low voltage, high current electrical pulse.

22. The method of claim 21, wherein said welding comprises passing the low voltage, high current electrical pulse through the pins of the wireless communication chip.

23. The method of claim 14, further comprising adjusting the position of the first cut and the second cut relative to each other based on a desired capacitance of the one or more antenna tabs.

24. The method of claim 23, wherein adjusting the position of the first cut and the second cut relative to each other based on the desired capacitance of the one or more antenna tabs comprises

adjusting the relative phases of the first die cut roller and the second die cut roller.

25. A method of preparing an antenna for use with a wireless communication device, the method comprising:

passing a conductive material on an adhesive backing through a pair of die cut rollers that create overlapping cuts in the conductive material to define a portion of a perimeter of one or more antenna tabs;

adjusting the overlap of the cuts made by the die cut rollers to adjust a size of the one or more antenna tabs cut by the die cut rollers;

removing unused conductive material from the adhesive backing; and

attaching the one or more antenna tabs to a wireless communication chip by;

creating fingers on the one or more antenna tabs;

heating pins of the wireless communication chip; and

inserting the pins of the wireless communication chip into a substrate so that the fingers on the one or more antenna tabs wrap around the pins.

26. A method of preparing an antenna for use with a wireless communication device, the method comprising:

passing a conductive material through a pair of rollers die cut rollers that create overlapping cuts in the conductive material to define a portion of a perimeter of one or more antenna tabs;

adjusting the overlap of the cuts made by the die cut rollers to adjust a size of the one or more antenna tabs cut by the die cut rollers; and

attaching the one or more antenna tabs to a wireless communication chip by;

creating fingers on the one or more antenna tabs;

heating pins of the wireless communication chip; and

inserting the pins of the wireless communication chip into a substrate so that the fingers on the one or more antenna tabs wrap around the pins.