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Method and apparatus for prevention of solder corrosion

  • US 7,651,890 B2
  • Filed: 09/15/2006
  • Issued: 01/26/2010
  • Est. Priority Date: 09/15/2006
  • Status: Expired due to Fees
First Claim
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1. A method of preventing corrosion of multi-chip module solder connections, comprising:

  • disposing a plurality of chips at a first side of a printed circuit board;

    defining a cap comprising a heat sink;

    disposing a molecular sieve in a cavity of the heat sink, the cavity defining a portion of the cap;

    positioning the cap over the first side of the printed circuit board, thereby defining a first chamber in which the plurality of chips is frilly contained;

    sealing the cap to the first side of the printed circuit board;

    disposing a stiffener at a second side of the printed circuit board thereby defining a second chamber between the stiffener and the second side of the printed circuit board;

    sealing the stiffener at the second side of the printed circuit board; and

    adsorbing moisture within the first chamber and second chamber with the molecular sieve.

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