Method and apparatus for prevention of solder corrosion
First Claim
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1. A method of preventing corrosion of multi-chip module solder connections, comprising:
- disposing a plurality of chips at a first side of a printed circuit board;
defining a cap comprising a heat sink;
disposing a molecular sieve in a cavity of the heat sink, the cavity defining a portion of the cap;
positioning the cap over the first side of the printed circuit board, thereby defining a first chamber in which the plurality of chips is frilly contained;
sealing the cap to the first side of the printed circuit board;
disposing a stiffener at a second side of the printed circuit board thereby defining a second chamber between the stiffener and the second side of the printed circuit board;
sealing the stiffener at the second side of the printed circuit board; and
adsorbing moisture within the first chamber and second chamber with the molecular sieve.
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Abstract
Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
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Citations
2 Claims
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1. A method of preventing corrosion of multi-chip module solder connections, comprising:
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disposing a plurality of chips at a first side of a printed circuit board; defining a cap comprising a heat sink; disposing a molecular sieve in a cavity of the heat sink, the cavity defining a portion of the cap; positioning the cap over the first side of the printed circuit board, thereby defining a first chamber in which the plurality of chips is frilly contained; sealing the cap to the first side of the printed circuit board; disposing a stiffener at a second side of the printed circuit board thereby defining a second chamber between the stiffener and the second side of the printed circuit board; sealing the stiffener at the second side of the printed circuit board; and adsorbing moisture within the first chamber and second chamber with the molecular sieve. - View Dependent Claims (2)
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Specification