Integrated circuit package system including stacked die
First Claim
Patent Images
1. An integrated circuit package system comprising:
- a die with bond pads formed on the die and a planarized bottom exposed surface;
a solder bump deposited on one or more bond pads;
a mold compound formed on the die, the mold compound embedding the bond pads and the solder bump; and
a recess formed into the edges of the mold compound to expose a portion of the solder bump.
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Abstract
An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.
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Citations
9 Claims
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1. An integrated circuit package system comprising:
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a die with bond pads formed on the die and a planarized bottom exposed surface; a solder bump deposited on one or more bond pads; a mold compound formed on the die, the mold compound embedding the bond pads and the solder bump; and a recess formed into the edges of the mold compound to expose a portion of the solder bump. - View Dependent Claims (2, 3, 4)
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5. An integrated circuit package system comprising:
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a die with bond pads formed on the die; a solder bump deposited on one or more bond pads; a mold compound formed on the die, the mold compound embedding the bond pads and the solder bump; a recess formed into the edges of the mold compound to expose a portion of the solder bump; a printed circuit board connected to a bottom exposed surface of the die; and electrical connectors connected to the exposed portion of the solder bump and the printed circuit board, wherein a combined height of the mold compound and the die is at least greater than a height of the electrical connectors. - View Dependent Claims (6, 7, 8, 9)
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Specification