Electronic device, cooling device and loop heat pipe

• US 7,652,885 B2
• Filed: 01/06/2009
• Issued: 01/26/2010
• Est. Priority Date: 03/27/2008
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro
• Primary Examiner(s): Thompson; Gregory D
• Application Number:
  US12/349,410
• Publication Number:
  US 20090244846A1
• Time in Patent Office: 385 Days
• Field of Search: 165/104.26, 165/104.33, 361/679.52, 361/700
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment, an electronic device includes a housing, a heat generating part contained in the housing, and a loop heat pipe contained in the housing. The loop heat pipe includes a heat receiving portion, a heat radiating portion, a vapor flow path and a liquid return flow path. The heat receiving portion includes a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path. The heat receiving portion is thermally connected to the heat generating part at a position across the first region and the second region.

Claims

1. An electronic device comprising:

a housing;

a plurality of heat generating parts contained in the housing; and

a loop heat pipe contained in the housing and formed by sealing an operating fluid in an annular internal fluid path,

the loop heat pipe comprising;

a heat receiving portion thermally connected to the heat generating parts;

a heat radiating portion configured to release the heat transmitted from the heat receiving portion to the outside;

a vapor flow path which connects the heat receiving portion and the heat radiating portion to each other, and through which the operating fluid evaporated by the heat receiving portion flows to the heat radiating portion; and

a liquid return flow path which is provided independently of the vapor flow path and connects the heat receiving portion and the heat radiating portion to each other, and through which the fluid flows to the heat receiving portion, and

the heat receiving portion further comprises a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow and connected to the vapor flow path, and is thermally connected to the heat generating parts at a position across the first region and the second region,

the heat generating parts are arranged in line on a border line between the first region and the second region.

2. The electronic device of claim 1, wherein the wick is formed continuously to extend from the first region to an inside of the liquid return flow path.

3. The electronic device of claim 2, wherein the wick is formed continuously to extend from the liquid return flow path to an inside of the heat radiating portion.

4. A cooling device comprising:

a loop heat pipe formed by sealing an operating fluid in an annular internal fluid path and comprising a heat receiving portion and a heat radiating portion;

a plurality of heat generating parts thermally connected to the heat receiving portion;

a heat sink which promotes heat radiation in the heat radiating portion; and

a fan unit which supplies an air blow to the heat sink,

wherein the loop heat pipe further comprises;

the heat radiating portion which releases the heat transmitted from the heat receiving portion to the outside;

a vapor flow path which connects the heat receiving portion and the heat radiating portion to each other and through which the operating fluid evaporated by the heat receiving portion flows to the heat radiating portion; and

a liquid return flow path which is provided independently of the vapor flow path, and connects the heat receiving portion and the heat radiating portion to each other, and through which the fluid flows to the heat receiving portion, and

the heat receiving portion further comprises a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow and connected to the vapor flow path, and is thermally connected to the heat generating parts at a position across the first region and the second region,

the heating generating parts are arranged in line on a border line between the first region and the second region.

5. The cooling device of claim 4, wherein the wick is formed continuously to extend from the first region to an inside of the liquid return flow path.

6. The cooling device of claim 5, wherein the wick is formed continuously to extend from the liquid return flow path to an inside of the heat radiating portion.

7. An electronic device comprising:

a housing;

a first heat generating part contained in the housing;

a second heat generating part contained in the housing; and

a loop heat pipe in which an operating fluid is sealed and which comprises;

a heat receiving portion configured to receive heat from the first heat generating part and the second heat generating part;

a heat radiating portion configured to release the heat transmitted from the heat receiving portion;

a second flow path connecting the heat receiving portion and the heat radiating portion to each other and provided with a wick; and

a first flow path connecting the heat receiving portion and the heat radiating portion to each other and provided independently of the second flow path,

wherein the heat receiving portion of the loop heat pipe includes a first region in which the wick extends to the second flow path, and a second region connected to the first flow path, the first heat generating part and the second heat generating part are thermally connected to the heat receiving portion at a position across the first region and the second region, and the first heat generating part and the second heat generating part are arranged in line on a border line between the first region and the second region.

8. The electronic device of claim 7, wherein the wick continuously extends from the second flow path to an inside of the heat radiating portion.